New Equipment | Test Equipment
Agilent/HP 8713C-101-100 Economy Network Analyzer, 300 kHz to 3 GHz. Key Features and Specifications Integrated transmission/reflection test set with narrowband and broadband detection "Real time" sweep speed (50 ms/sweep), synthesized
New Equipment | Test Equipment
The SR760 and is a single-channel, 100 kHz FFT spectrum analyser with a dynamic range of 90 dB and a real-time bandwidth of 100 kHz. The speed and dynamic range of these instruments, coupled with their flexibility and many analysis modes, makes them
New Equipment | Wave Soldering
Plastlist is specialized in design, manufacturing, material and accessories supply for wave soldering carrier. We can guarantee to provide customers with the best quality, the competitive price and the prompt delivery. Our own brand Plastlist DS and
New Equipment | Assembly Services
GKG printing scraper SMT printing scraper Scraper (aluminum alloy) Printing scraper features: Solder paste printer steel scraper structure is divided into: head, blade section, the blade and points: steel blade, plastic scraper pills two kinds, usua
New Equipment | Assembly Services
printing scraper SMT scraper holder (with a scraper) Printing scraper features: Solder paste printer steel scraper structure is divided into: head, blade section, the blade and points: steel blade, plastic scraper pills two kinds, is usually steel b
New Equipment | Test Equipment
The Agilent 85107B microwave vector network analyzer is a complete system configured with an Agilent 8510C vector network analyzer, a 50 GHz S-parameter test set, a 50 GHz synthesized sweeper, and 2.4 mm measurement accessories. Option 005 adds step
Technical Library | 2016-11-03 17:53:56.0
We present a novel method for fabricating a high-density carbon nanotube microelectrode array (MEA) chip. Vertically aligned carbon nanotubes (VACNTs) were synthesized by microwave plasma-enhanced chemical vapor deposition and thermal chemical vapor deposition. The device was characterized using electrochemical experiments such as cyclic voltammetry, impedance spectroscopy and potential transient measurements. Through-silicon vias (TSVs) were fabricated and partially filled with polycrystalline silicon to allow electrical connection from the high-density electrodes to a stimulator microchip.In response to the demand for higher resolution implants, we have developed a unique process to obtain a high-density electrode array by making the microelectrodes smaller in size and designing new ways of routing the electrodes to current sources.
Industry News | 2004-05-10 11:27:07.0
Parvus Audio Card Offers Powerful 2 Watts per Channel Output for Recording, Compressing and Playing Back CD Quality Sound
Career Center | Dallas, Texas USA | Engineering
Job description: Engineer is responsible for the design of RF, Microwave and support circuitry for miniaturized Rf/Wireless modules utilizing highlt integrated semiconductors and an array of substrate and packaging technologies. Will design, simula
Career Center | , Massachusetts USA | Engineering
Job Description RF Test Development Engineer Candidate will be capable of providing strong technical leadership for several engineers in the design, programming and documentation of RF test fixtures and procedures. Requirements for this position in
