Industry News: tenting and thickness (Page 5 of 13)

New Dry Film Negative Photoresist for MEMS and Wafer-Level Packaging

Industry News | 2017-01-09 18:11:30.0

Engineered Material Systems is pleased to introduce the DF-3560 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer-level packaging and CMOS applications (TSV sealing). This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.

Ersa to Introduce XL Rework and Selective at APEX

Industry News | 2019-01-03 20:11:46.0

Kurtz Ersa will exhibit at the 2019 IPC APEX EXPO, scheduled to take place Jan. 29-31, 2019 at the San Diego Convention Center in CA. The company will introduce the HR 600 XL and the VERSAFLOW 4XL with VERSAFLEX in Booth #2706.

kurtz ersa Corporation

Enhanced Squeegee QC with ID and Date Coding

Industry News | 2020-05-12 12:27:01.0

Transition Automation has introduced new product IDs that afford better quality control for squeegee end users. The company now applies indelible marking, which includes Date of Manufacture and Dimensional Part Numbers. The Date of Manufacture gives end users a better idea of product replacement cycles – which tend to be beyond one-year intervals. So date coding is deemed more important due to the long lifespan of the product.

Transition Automation, Inc.

Perllo Technologies Introduces Extec�s new line of Steel-Inked and 3-D Thick Film Hybrid Technology into US Marketplace

Industry News | 2004-11-19 15:47:39.0

Perllo Technologies LLC is pleased to announce its new partnership with Extec Integrated Systems Limited ("Extec") of Hampshire, United Kingdom.

Perllo Technologies

Barry Industries and Modelithics Develop Broadband 5mm C-QFN Package Model to 40GHz

Industry News | 2016-02-06 00:54:37.0

Barry Industries and Modelithics, Inc. have published a report detailing the broadband performance of Barry's 5mm high temperature co-fired ceramic (HTCC) quad-flat-no-leads (QFN) package to 40GHz. Barry Industries is an ISO9001:2008 certified ITAR-registered manufacturer of high quality thick film resistors, terminations, attenuators and high temperature co-fired ceramic (HTCC) packaging.

Barry Industries, Inc.

Barry Industries and Modelithics Develop Broadband 5mm C-QFN Package Model to 40GHz

Industry News | 2016-02-06 00:54:38.0

Barry Industries and Modelithics, Inc. have published a report detailing the broadband performance of Barry's 5mm high temperature co-fired ceramic (HTCC) quad-flat-no-leads (QFN) package to 40GHz. Barry Industries is an ISO9001:2008 certified ITAR-registered manufacturer of high quality thick film resistors, terminations, attenuators and high temperature co-fired ceramic (HTCC) packaging.

Barry Industries, Inc.

Aries' New Cost-Effective CSP/MicroBGA Test and Burn-In Socket

Industry News | 2003-07-08 09:09:15.0

Available for Devices Up to 13 mm2 with Speeds Up to 1 GHz

Aries Electronics Inc

Essemtec Provides High-Resolution SPI for Printing and Dispensing Processes

Industry News | 2011-05-27 21:57:47.0

Traqu is a high-resolution digital 3-D inspection device from Essemtec used for 3-D measurement and analysis in processes such as solder paste inspection (SPI). Measurement tasks are programmed with a few mouse clicks, and DXF and Gerber data can be imported.

ESSEMTEC AG

Four types of plasma surface treatment and material surface reaction

Industry News | 2021-04-09 02:12:31.0

The reaction between the plasma surface treatment machine and the surface of the material is both physical and chemical. Through the reaction, the surface of the material will become rough, and at the same time, the oxide can be reduced, making the surface of the material hydrophilic and cohesive. Dyeability, biocompatibility and electrical properties have been greatly improved.

DONGGUAN KEQI AUTOMATION EQUIPMENT CO.,LTD

Engineered Material Systems, Inc. Develops Negative Photoresist for MEMS and IC Wafers

Industry News | 2017-03-20 17:31:31.0

Engineered Material Systems is pleased to introduce the DF-35120 dry-film negative photoresist for use in micro-electro mechanical systems (MEMS), wafer level packaging and CMOS applications (TSV sealing). The dry film is 120 µm thick. This material formulation has been optimized for hot roll lamination and processing on MEMS and IC wafers.

Engineered Materials Systems, Inc.


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