Electronics Forum | Tue Jan 31 12:02:22 EST 2006 | aj
how would you apply both pastes.? anyway, I have succesfully run leadfree bga with lead paste. You gotta find a profile that kinda meets both requirements. Taking into consideration the peak temp and time above. dont have details on hand but I ca
Electronics Forum | Wed Feb 01 06:02:59 EST 2006 | joe
Hi, SAC BGA's in a SnPb reflow process can be achieved by ensuring the temp. on the BGA is at a peak min of 220�C and a time above 207-210�C for 60 - 90 Sec. Lower temperatures have shown incomplete mixing of alloys and some voiding.
Electronics Forum | Fri Oct 06 15:43:33 EDT 2006 | Mario Scalzo, SMT CPE
What I usually do is keep the peak temperature about 5-10 deg C below the peak temperature of my lowest rated component, then set everything else up around that. Worse case scenario is to just extend the time above liquidus (TAL) in 5 second increme
Electronics Forum | Mon Feb 12 13:01:09 EST 2007 | campos
Hi all,, I running SMQ230 solder paste with a time above = 40sec with peak temperature = 239 degrees .. the complete reflow takes almost 6 min with a slope (150to190) close to .60 degrees/sec .. may I have some concern about that or it's ok?? tks..
Electronics Forum | Thu Apr 24 21:52:18 EDT 2008 | fowlerchang
We have measured the temperature of CSP solder joint. The peak temperature is 232oC and the wetting time above 217oC is 30s. But we use leaded solder paste instead of lead free solder paste. I doubt why no crack of solder joint was observed after cr
Electronics Forum | Thu Jun 19 11:43:05 EDT 2008 | Roy
When the component suppliers specify the cap as no more than 50sec (or even less time)above 200C, is there any way the lead-free profile window will fit if we wil have to achieve a peak temp of 230c for at least 30sec for the lead-free process? maybe
Electronics Forum | Thu Jun 19 15:52:16 EDT 2008 | guqing
So correct me if I'm wrong: you are using a conventional oven (not VP, otherwise you must have mentioned), your big electrolytic caps go through a lead-free profile, which requires 30sec minimum at 230, but your time above 200C on the caps is less th
Electronics Forum | Fri Aug 15 10:23:56 EDT 2008 | ck_the_flip
Ovens, and any other process for that matter, will ALWAYS vary. It's called process variation. I do Cpk (process capability) on my ovens. I track time-above-liquidus and peak temperatures. Statistics will validate how repeatable your oven is.
Electronics Forum | Mon Feb 02 09:22:55 EST 2009 | ck_the_flip
Everyone's telling you setpoints, but yet, we haven't seen a thermal profile from you. It'd help if you can provide this, and using everyone's recommended setpoints, determine if your profile is meeting: 1.)Time Above Liquidus 2.) Peak 3.) Ramp
Electronics Forum | Wed Oct 06 17:50:00 EDT 2010 | jamyboy
IBM Intel motorola did exhaustive studies on this and found that the best thing to do is (as others pointed out) the PBfree BGA reaches 217 minimum and the time above 217 must be extended to allow mixing of the 2 alloys. See attached a little diddy
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