Full Site - : what causes solderability failure in enig (Page 5 of 40)

CeTaQ Highlights the Importance of SPC in SMT

Industry News | 2008-05-03 17:09:31.0

HUDSON, NH � May 1, 2008 � CeTaQ, the leader in quality analysis and optimization of SMT production processes, announces that statistical process control (SPC) is the key to combining high quality with low costs.

CeTaQ Americas, LLC (formerly EAGLE-EYED ONE Sales & Service)

Yestech's AOI Role in Hazardous Area Instrument Manufacturing

Industry News | 2013-11-08 11:15:49.0

AOI can be a powerful tool when effective quality management becomes an absolute priority. Below, Andy Bonner, Managing Director at Cupio Yestech Europe demonstrates this with a look at BEKA associates, who are using AOI within their manufacturing operation producing display instruments certified for safe use within potentially hazardous areas..

Nordson YESTECH

Scanning Acoustic Microscopy Analyzes 3D Packages in the Z-dimension

Industry News | 2019-05-31 08:50:57.0

Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis

PVA TePla America

Scanning Acoustic Microscopy Analyzes 3D Packages in the Z-dimension

Industry News | 2019-05-31 08:56:07.0

Non-destructive testing of 3D packages with scanning acoustic microscopes identifies defects down to sub-micron level for 100% inspection, failure analysis

PVA TePla America

EV Experts to Share Technical Insights in High-Density Assemblies Webinar

Industry News | 2022-09-15 06:29:44.0

As part of its electric vehicle (EV) focused series of webinars, Driving e-Mobility: Rel-ion™ Technical Webinars, Indium Corporation's Jonas Sjoberg, associate director for global technical service & application engineering, and Ângelo Marques, applications engineer – design for excellence (DfX) specialist, will share considerations for the implementation of high-density assembly in the automotive space.

Indium Corporation

How Clean is Clean Enough – At What Level Does Each of The Individual Contaminates Cause Leakage and Corrosion Failures in SIR?

Technical Library | 2016-09-08 16:27:49.0

In this investigation a test matrix was completed utilizing 900 electrodes (small circuit board with parallel copper traces on FR-4 with LPI soldermask at 6, 10 and 50 mil spacing): 12 ionic contaminants were applied in five concentrations to three different spaced electrodes with five replicas each (three different bare copper trace spacing / five replications of each with five levels of ionic concentration). The investigation was to assess the electrical response under controlled heat and humidity conditions of the known applied contamination to electrodes, using the IPC SIR (surface insulation resistance) J-STD 001 limits and determine at what level of contamination and spacing the ionic / organic residue has a failing effect on SIR.

Foresite Inc.

KYZEN to Participate in a Live Webinar Focusing on QFN Design, Cleaning & Reliability

Industry News | 2016-10-09 21:05:56.0

KYZEN is pleased to announce that Dr. Mike Bixenman and a panel of experts will participate in an informative webinar on Thursday, Oct. 13, 2016. The webinar, entitled, “QFN: Design - Cleaning - Reliability: What you can't see can cause failure!” will be hosted by Global SMT & Packaging Magazine.

KYZEN Corporation

Aqueous Technologies’ CEO Mike Konrad to Present at the Cleaning and Reliability Workshop in Huntsville, AL

Industry News | 2012-08-15 10:34:48.0

Aqueous Technologies Corp., North America’s largest provider of batch defluxing systems, announces that its CEO Michael Konrad will present “Electrical Leakage, Dendritic Growth, and White Residue – The Rush to Clean No-Clean” at the upcoming Cleaning and Reliability Workshop,

Aqueous Technologies Corporation

Aqueous Technologies’ CEO to Present at ETEK Europe’s Technology Day in Scotland

Industry News | 2013-06-12 14:15:08.0

Aqueous Technologies announces that its CEO Michael Konrad will present at ETEK Europe Ltd.’s Cleaning & Conformal Coating Technology Day.

Aqueous Technologies Corporation

MacDermid Alpha Electronics Solutions to Participate in Panel on Solutions for Head-in-Pillow Defects

Industry News | 2022-04-13 09:47:35.0

MacDermid Alpha Electronics Solutions will be participating in the upcoming Global SMT & Packaging panel discussion, "Head-in-Pillow - what causes it, how do you spot it and how do you avoid it?" on April 19 at 10:30 am New York / 3:30 pm London.

MacDermid Alpha Electronics Solutions


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