Electronics Forum | Fri May 09 09:31:04 EDT 2014 | jorge_quijano
we are placing small QFNs with no major issues, but this one may not seem like a QFN with thermal pad... I'm attaching a picture of the component.
Electronics Forum | Thu May 08 18:21:13 EDT 2014 | jorge_quijano
Hola, We are about to start building a new PCBA using a LGA, we have not used such components in the past, is there any recomendations you can provide me? I've found some articles saying that stencil thickness is the key, what is your experince usin
Electronics Forum | Thu May 08 19:52:40 EDT 2014 | hegemon
There are many different style LGA packages, but don't sweat it. Stick with the manufacturers recommendations for PWB pad geometry for a start. Voiding can be reduced by careful profiling, and also by pre-tinning the devices. QFN style packages can b
Electronics Forum | Fri May 09 14:40:38 EDT 2014 | hegemon
I might start with the equivalent 4 or 5 mil stencil and 1:1 on the apertures. If voids are too prevalent, then I would tin the pads of the device, remove the solder, and then solder as above. You may have another hurdle, in that the resulting stan
Electronics Forum | Thu Dec 05 15:07:12 EST 2019 | thunder
Print is so small ,can't read it,bunch of numbers/letters. Don't see any numbers/letters on the part itself,just around it. When I get the magnifying glass I'll get the part number and look it up to see exactly what it is.
Electronics Forum | Thu Dec 05 11:40:36 EST 2019 | slthomas
That's a good point, although hand soldering a xfmr on a RoHS assembly isn't going to be a walk in the park. My other question would be did it fail because it got hot, or did it get hot because it failed?
Electronics Forum | Thu Sep 11 16:06:34 EDT 2014 | gregp
Hello Esteemed Panel, I have a question...what is the most cost effective way to get power to a PCB? By this I mean connecting power and ground without a connector but something more reliable than soldering a wire directly to the PCB. Whatever solut
Electronics Forum | Tue Oct 14 07:30:00 EDT 2014 | rob
For low voltage and current applications there are also some nice SMT conductive foam pads that come in on tape. http://www.gore.com/MungoBlobs/621/772/SMT_Grounding_Pads.pdf I think Laird also do something similar. We place them with no problem.
Electronics Forum | Thu Oct 02 15:28:19 EDT 2014 | arifa_anees
it all depends on the situation, your circuitry and components. ground place should always be below or above the signal and power traces to minimize loops and reduce EMI generated by the board.If you have multiple power voltages and a 4-layer board y
Electronics Forum | Tue May 01 10:44:28 EDT 2012 | streuzucker
How about BEE Packaging? http://www.beepackaging.com/ic-tubes.html
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