NXP New and Original MK64FN1M0VLQ12 in Stock IC LQFP144, 2021+ package MK64FN1M0VLQ12 Kinetis K64: 120MHz Cortex-M4F MCU, 1MB Flash, 256KB SRAM, Full-Speed USB, Ethernet, 144-LQFP Today's Hot Deals： TMS320DM8127SCYE3H BGA RENESAS/ 18+ SI5338
TI New and Original CDCV304TPWREP in Stock IC TSSOP-8 16+ package CDCV304TPWREP General Purpose and PCI-X 1:4 LVCMOS Clock Buffer AD7731BRUZ-REEL7 TSSOP-24 TSSOP-24 22+ AD8251ARMZ MSOP10 AD 21+ STM32F429IGT6 LQFP176 ST 21+ SM3ZS067U310AMR12
TI New and Original TPL8002-25PWR in Stock IC TSSOP16 22+ package TPL8002-25PWR 64-tap digital potentiometer in series AD7731BRUZ-REEL7 TSSOP-24 TSSOP-24 22+ AD8251ARMZ MSOP10 AD 21+ STM32F429IGT6 LQFP176 ST 21+ SM3ZS067U310AMR1200 N/A JAE 2
TI New and Original LM2576HVSX-ADJ/NOPB in Stock IC SOT263 21+ package LM2576HVSX-ADJ/NOPB Step-Down Switching Regulator IC Positive Adjustable 1.23V 1 Output 3A TO-263-6, D²Pak (5 Leads + Tabs), TO-263BA AD7731BRUZ-REEL7 TSSOP-24 TSSOP-24 22+
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Industry News | 2019-09-30 08:53:43.0
10.01.2019 – Atlanta – During a two-day technical workshop in New England, Koh Young America will discuss the important role of solder paste inspection (SPI) to understand and then optimize the solder paste print process to improve printed circuit board assembly production yield. Additionally, Panasonic will discuss how the proven connectivity between its printers and mounters and the Koh Young SPI and Automated Optical Inspection (AOI) equipment will benefit manufacturers with Advanced Process Control (APC). The 2-day Print Process Characterization workshop is scheduled for 23-24 October 2019 at the Westford Regency with live machine demonstrations at the Assembly Products Lab in Chelmsford, MA.
Electronics Forum | Tue Nov 02 05:00:28 EST 2004 | jysam
we are using solder paste WS609 and OM5100.Relow oven: forced convection type. For WS609 and OM5100, straight ramp up profile is suitable for low to medium thermal mass assemblies and preheating may be required for high thermal mass assemblies. How
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