Electronics Forum: best (Page 431 of 524)

Re: Siemens's users. What do you think ?

Electronics Forum | Tue Apr 21 12:48:41 EDT 1998 | Derek Drabenstadt

| I would like to know something about Siemens machines from users of Siplace or old machines. | Thanks ! I have been working in a shop with 80-S and 80-F machines for two years. The down time we have experienced is significant. Up to 25%.

Re: Why does everyone want to x-ray BGA?

Electronics Forum | Thu Apr 16 23:59:45 EDT 1998 | Mike C

| Hello Ya'll, | I've got what may be a silly question, but why does it seem so important to everybody that you have x-ray capability if you're thinking about doing BGA? | I know what most people will tell me; "Steve, that's a pretty silly qu

Re: Temperature profile req's for Pin In Paste process

Electronics Forum | Mon Apr 13 07:55:48 EDT 1998 | justin medernach

Dear Justin, I am not asking for experiences with ovens as to whether you think they are capable of THT reflow. I am asking more specifically about actual req's and experiences with THT reflow, regardless of the oven used. Your answer does not hold i

Re: SM Headers & Connectors

Electronics Forum | Wed Apr 08 12:29:08 EDT 1998 | Justin Medernach

| Is it just me, or does anybody else have problems with open connections on small surface mount headers and connectors? I am talking about small 20 to 40 pin devices, 25 to 50 mil pitch. We put these things on the board, the feet look like they ar

Re: Selective Wave Soldering

Electronics Forum | Tue Apr 07 14:37:14 EDT 1998 | Chrys

Be careful about the material you choose. All the materials out there are basically glass-filled epoxy composites, but they are different blends with different fillers. Some of them have carbon in the matrix to make them ESD safe, but it also short

Re: Cleaning Ceramic Substrates

Electronics Forum | Wed Mar 25 14:05:18 EST 1998 | Justin Medernach

| We currently use an abrasive fiberglass brush to clean the silver oxide off of our substrates proir to asembly. It's messy and tiring. Is there an alternative method, either chemical or mechanical that is cost effective for small (30 to 50ea 6in

Re: Reflow Oven Evaluation Using Cpk

Electronics Forum | Fri Mar 20 15:10:54 EST 1998 | Steve Abrahamson

| Cpk's on top flight ovens (e.g., Conceptronics, Heller, Electrovert, Vitronics) vary wildly, from 1 to 2+, between different supplers. The suppliers don't seem to understand Cpk's. A supplier's rep whose oven has a Cpk of 1.0 told me: | 1. Cpk's

Re: PCB Warping.

Electronics Forum | Mon Mar 16 18:15:32 EST 1998 | ETS, LLC

Problem occurs because the glass transition temp for FR4 is lower than reflow temperature. Our company wrote an article which was printed in SMT magazine some years ago that deals with this exact subject. Best way to deal with this is to use a center

HASL PCB non-wetting

Electronics Forum | Mon Mar 16 01:06:25 EST 1998 | Victor Ng

Dear all, Recently I have a problem of non-wetting at our wave soldering process. It appears only on the SMT pads for the chip components (at the solder side) of the HASL PCB. With all the same parameters on the wave soldering machine, i

Re: Entek coating

Electronics Forum | Sun Mar 15 23:58:01 EST 1998 | Phill Hunter

| | I am having a problem with Entek coated boards. The solder past seem to just ball up on the pads. I had no problems with the board when it was hot air leveled. The board is double sided surface mount. I have tried adjusting the oven profiles m


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