Electronics Forum | Wed Jun 14 12:43:52 EDT 2000 | Todd Murphy
Dave, you are right you would expect the soldermask to be higher than all SMT pads on the pcb if it is higher on the fine pitch components, but the other areas of the board do not concern me as much as the fine pitch areas. The pads on all the other
Electronics Forum | Sat May 27 12:50:21 EDT 2000 | Micah Newcomb
Steve, I use homebase apertures as a standard for all chip parts and have no complaints, no solder beading, no issues. I have had to replace almost all stencils ordered previous to my arrival as they all caused defects (7-9mil thickness and 1:1
Electronics Forum | Wed May 24 15:40:08 EDT 2000 | A M
I work with a Dek 265 horizon, and i like the machine it`s very good. In this machine i work with Proflow, in the begine i have some problems but now it`s work very nice. It�s more expencive, but the stencil it�s more durable, the machine it`s more c
Electronics Forum | Wed May 17 20:37:08 EDT 2000 | Steve
At our facility, we process FR-4 boards for PCMCIA cards (0.020"). The key for us is dedicated fixturing for stencil printing and fixturing for reflow soldering. We are working closely with our customer to better improve panel design, but other than
Electronics Forum | Wed May 31 23:19:15 EDT 2000 | Jackie Hsieh
I think the reasons of the tombstone phenomenon could be concluded as follows: 1.The proper pad size,including the dimension of two pads,the gap of two pads. 2.The temperature distribution must be uniform (take care the shadow-effect) 3.The ramp-up s
Electronics Forum | Wed May 10 01:00:09 EDT 2000 | gary
0.65mm pitch QFP. I believe that this is the borderline for Fine Pitch. Will I have a good paste release with Chem-etch matched with a rubber squeegee? I'm planning of a 15% reduction on the Width and no reduction on the length. Any feedback whether
Electronics Forum | Thu Apr 06 00:27:42 EDT 2000 | Dean
I would check their data sheet for the particular product. Thats the range I have for Some Kester products I use... Are you seeing any slumping prior to pick-and-place? Is the bridge in the same place every time? How is your pick-and-place mounting
Electronics Forum | Tue Apr 04 10:08:33 EDT 2000 | Russ
Neil, IPC 610 has the criteria for solder balls re. quantity and size per sq./in. These are acheivable requirements but no-clean is not necessarily a drop in process. You need to review stencil /pad /component design to ensure that "midship" solde
Electronics Forum | Fri Mar 03 16:11:07 EST 2000 | cpitarys
Yes it is Ok and some folks ae doing it now, but unfortunatly IPA may not be the best solvent for this application. Take a small vial of the ipa and put some of your smt adhesive into it, shake it up and watch what happens, now step this up onto a l
Electronics Forum | Wed Feb 23 21:35:01 EST 2000 | Dave F
Larry: You're correct to question this: * We don't like to run raw paste through our aqueous cleaner. It makes a blinking mess. Your entire machine is probably now coated with hazardous material ... well at least the first tank and the out-bound
