Electronics Forum | Thu Feb 18 17:49:28 EST 1999 | Ryan Jennens
Hey all- My question is this: My stencil printer operator has said that he has to wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch aperatures for a QFP to release well. We are using Amtech NC-559 type 3 paste with 89.5% metal
Electronics Forum | Fri Feb 05 12:52:22 EST 1999 | Jason Hall
| Anyone heard of a BGA599. I was wondering the package size of this part, and if a GSM-1 would have any problems placing it. | | Jamie Ford | I am not sure of the package size of this part but I do not see why a GSM-1 would have any problems pla
Electronics Forum | Tue Feb 02 09:51:38 EST 1999 | Justin Medernach
| Hello Everybody: | | I am in urgent need of some information regarding the reflow profile for a flip chip wafer. Would the reflow conditions along with the flux used affect the appearence of the solder joints. | | We are witnessing dull solder j
Electronics Forum | Tue Feb 02 21:55:20 EST 1999 | Jon Medernach
Chris is correct. You will have a problem if you do not have the right metalization under your bump. The BM is critical, it is defined by the passivization layer on top of your die much like a solder mask defined interface on FR4. You will find mos
Electronics Forum | Fri Jan 15 11:26:24 EST 1999 | Chrys
Hello, We are qualifying new sources of PWB vendors. We've got the first lot of "produciton" boards in and we want to put them through the paces before turing the vendors on. So far, the tests I can think of performing, and that we have the capabi
Electronics Forum | Tue Jan 12 17:03:59 EST 1999 | Ryan Jennens
How is everybody? I was asked about any problems that would be associated with having a plastic casing injection molded around an assembled PCB. I am not sure if injection molded plastic has to be hot, I am assuming so (can they use epoxies?).
Electronics Forum | Wed Jan 13 15:43:00 EST 1999 | Dave F
| How is everybody? | | I was asked about any problems that would be associated with having a plastic casing injection molded around an assembled PCB. I am not sure if injection molded plastic has to be hot, I am assuming so (can they use epoxi
Electronics Forum | Thu Dec 24 02:17:22 EST 1998 | Chris Grendler
Anyone ever attach gold bump flip chip to FR4 or Alumina substrates. Am trying to find a solder which is acceptable for use on gold. Am worried about gold imbrittlement since the gold bumps on the flip chip are .004"x.004"x.001" solid gold. The pit
Electronics Forum | Thu Dec 24 09:32:53 EST 1998 | Earl Moon
| Anyone ever attach gold bump flip chip to FR4 or Alumina substrates. Am trying to find a solder which is acceptable for use on gold. Am worried about gold imbrittlement since the gold bumps on the flip chip are .004"x.004"x.001" solid gold. The p
Electronics Forum | Thu Dec 24 13:29:19 EST 1998 | Chris Grendler
| | Anyone ever attach gold bump flip chip to FR4 or Alumina substrates. Am trying to find a solder which is acceptable for use on gold. Am worried about gold imbrittlement since the gold bumps on the flip chip are .004"x.004"x.001" solid gold. The
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