Electronics Forum | Tue Apr 06 16:22:58 EDT 1999 | Dave F
| 0603's and 0402's are being damaged by the water wash post reflow. PCA's are 1" X 4" and 2" X 2" approximately. | | We've adjusted water pressure so that the top-down is higher than the bottom up. | | The baskets have a .5" mesh spacing. Some
Electronics Forum | Sun Mar 21 06:27:45 EST 1999 | Bob Willis
| Hi Folks, | This is my first surface mount board, so I asked our assembly house for some tips. They said only passives on the bottom side-preferably no smaller than 0805, 0603 only if I have to. I would think that an SOT-23 would be OK on the botto
Electronics Forum | Tue Mar 16 17:05:14 EST 1999 | Jeff Dahlin
We are having a small number (~2%) of our boards pass our manufacturing diagnostics, fail once they reach the customer, fail when they get back to us and then start working again after handling them for a short time. We have eliminated a lot of item
Electronics Forum | Wed Mar 17 09:32:35 EST 1999 | Dave F
| We are having a small number (~2%) of our boards pass our manufacturing diagnostics, fail once they reach the customer, fail when they get back to us and then start working again after handling them for a short time. We have eliminated a lot of it
Electronics Forum | Sat Mar 06 08:35:21 EST 1999 | Dave F
| Clarissa, | | Dave had good suggestions. We load several boards manual at this time. We set our components up in clearly marked bins. The documentation includes a chart with the part number, bin number, reference designator and color code for t
Electronics Forum | Mon Mar 01 09:14:00 EST 1999 | Jules Winfield
| I'm trying to get a feel for what the industry is doing with regards to collecting assembly defect data in the SMT/PWA process. Is it sampling or 100%? What are the points within the process where critical assembly defect data is collected. We run
Electronics Forum | Tue Feb 09 18:48:21 EST 1999 | Earl Moon
| Has anyone had any experience in using SMT to mount an organic (FR-4, Getek) rider card onto an organic (FR-4, Getek) mother board? By SMT I mean the attachment of the rider card would be through pads directly to pads on the mother board. | | Than
Electronics Forum | Thu Feb 04 16:08:05 EST 1999 | Ryan Jennens
| I realize it's been discussed many times before. I need to know your opinions, experience, and knowledge concerning "today's"/latest and best pallet designs, suppliers, and methods for using them more effectively. | | Thanks much, | | Earl Moon |
Electronics Forum | Tue Feb 02 12:31:26 EST 1999 | John
| I have a product using high temperature solder to connect terminal pins to a PCB. The board is single sided copper, no plaiting. The solder is 95% tin 5 % silver. The flux is low activity rosin. The product is a subassembly. When the product i
Electronics Forum | Fri Jan 08 19:47:55 EST 1999 | Kwang-Seong Choi
| | HI! I am a package engineer in Korea. I have some reasons | | to desolder excessive solder at the lead of TSOP and TSOJ | | after removing them from the board. The way with solder wick is too time-consuming and depends on the operator. | | Does
