Electronics Forum | Wed Jun 02 09:55:31 EDT 1999 | Jason Gregory
Hello Dan, I have recently started using polyimide, but not for the standard uses. I designed a pallet for holding small, thin (about .0018" thick) RF boards that were being reflowed inside their aluminum housings. They were screwed down to prevent w
Electronics Forum | Wed May 26 14:24:13 EDT 1999 | Boca
| | we have just started wave soldering passive SMT components and through hole. We are having trouble with voids on the SMT components. It is very random, but effects a lot of TSOT's. We are using an electrovert with a chip wave. Are there any o
Electronics Forum | Fri Apr 23 14:59:14 EDT 1999 | Chrys Shea
| Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free soldering on these g
Electronics Forum | Fri Apr 23 15:04:44 EDT 1999 | M.T.
| | Has anyone had trouble waving and gluing 0603 R's and C's? At my company, our designers have "opened the floodgates" on bottom-side 0603's. | | | | We've got an EPK+ with rotary chip and omega wave but can't seem to get skip-free soldering on t
Electronics Forum | Mon Apr 26 09:46:05 EDT 1999 | C.K.
Chrys: I have checked all the basic elements of Wave solder joint formation: fluxing, preheating, and lastly soldering. For checking the fluxer, i used a product from ECD that's very similar to what you desribed called the flux-o-meter. It did a
Electronics Forum | Tue Apr 20 14:25:05 EDT 1999 | Stephen Smith
I am wondering if anyone has any info regarding solder paste misprint clean-up procedures for Entek Plus CU-106A PCB's utilizing a water-clean solder paste. In a implementation procedure they recommend a 2-3 minute wash cycle with the following crit
Electronics Forum | Fri Sep 11 09:45:39 EDT 1998 | Earl Moon
| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re
Electronics Forum | Tue Aug 25 21:01:45 EDT 1998 | Peter
We use an Intermec 3240 Thermal transfer printer and print on polyimid label material that survives the reflow and wave solder (top side only) process without turning black. Labels run around 3-4 cents per depending on the size (We found Imtec label
Electronics Forum | Mon May 18 13:30:15 EDT 1998 | Earl Moon
| I'm reviewing my board fab spec. It calls for a minimum SnPb thickness of 50 microinches on HASL PWB's. I've looked at other specs that call out anything from 30 to 80 microinches, and others that just say the copper pad must be covered and solde
Electronics Forum | Wed May 06 09:16:51 EDT 1998 | justin medernach
| I hear that there is a problem with using ceramic parts that are sizeable. Apparently, there is a mismatch in the Temperature Coefficient of Expansion between the FR4 and ceramic materials which causes the soldered erminations to weaken and eventua
