Electronics Forum | Sun Dec 28 05:31:59 EST 1997 | Bob Willis
We have a x ray inspection criteria video and poster set which may be of interest check out our home page www.bobwillis.co.uk | | I'd like someone gives me a tip for elemating of voids | | in the mico BGA solder joint and the method of inspection |
Electronics Forum | Fri Aug 10 13:09:49 EDT 2001 | Hussman
Hey Wister, Assuming you are talking about BGA voids, and you just want to try and optimize your profile, you could try a "straight ramp profie". This is where the soak temp is constantly being elivated until you hit reflow. I find this helped me
Electronics Forum | Wed Nov 21 21:50:50 EST 2001 | Glenn Robertson
Tony, What you are seeing can occasionally be caused by gaps in the plating of the blind vias. If they are not "airtight" you can get moisture coming from the laminate that shows up as voids in the solder balls. You might check on the board sup
Electronics Forum | Tue Jan 21 16:28:02 EST 2003 | tony_sauve
Sorry I didn't close this one off last year... We had some failure analysis done on these PCB's ( 3D x-ray,microsectioning,SEM) and the results definitively proved that there was some contamination @ the base of the uvia's that had the voiding. It ap
Electronics Forum | Mon Jun 17 13:07:11 EDT 2002 | Robert Hartmann
Can anyone point me to a specification or paper describing the existance of voids in transfer mold epoxies during CSP assembly? We have found very small bubbles in our process, but cannot find any information as to whether this is acceptable, and if
Electronics Forum | Mon Jun 17 21:31:23 EDT 2002 | davef
Most of our discussions here on SMTnet have focused on underfills. With transfer molding, voiding near the die, wire bonds, or leads contribute to more failures than others. Try: * Tim Chen, Cookson Semiconductor 800-223-9057 * Ron Molnar, Abpac In
Electronics Forum | Thu Oct 10 16:13:01 EDT 2002 | slthomas
"Do you work for Air-Vac or what?" My question as well. If so, it is my opinion that there is a need for some house cleaning, because dissing a competitor's product on this forum is gutter-dweller tactics. If not, can you (AJ, not Russ) provide so
Electronics Forum | Thu Apr 17 14:14:17 EDT 2003 | davef
Takfire Questions are: * Why does your customer think the capacitor is the issue? [What are we thinking? Of course the capacitor is causing this voiding problem. What else could it be?] * What are the type, construction, end-cap material and plati
Electronics Forum | Sat Jul 31 23:17:48 EDT 2004 | Bryan Sherh
Hi,Please 1.X-ray your board where you found pinholes.perhaps you'll found much voids in your joints,but not only the pinhole.this must be caused by the poor solderability of PCB mostly...or components. 2.Cross-section the pin hole or void in the joi
Electronics Forum | Mon Dec 13 14:57:41 EST 2004 | DasonC
I run a D.O.E. and print different water soluble pastes on the same board by mini-stencil and reflow on same profile. WS709 is one of them but Indium6.2 shown less and no void then WS709. P.S.: profile may affect the result. Do U have Via in pad?
