Electronics Forum | Mon Mar 01 09:17:56 EST 2010 | duso02
Hey....I think it might be the silicone adhesive! LOL Yeah, that'll do it. We use simple Shercon paper dots. Work like a charm. No evidence of "de-wetting".
Electronics Forum | Tue Mar 16 16:59:09 EDT 2010 | davef
Most often 'solder graping' refers to poor solder wetting, where the solder paste has partially melted, but has not coalesced or flowed. Sometimes this leaves the outline of the partially melted solder balls still visible, giving the appearance, to
Electronics Forum | Fri Jun 25 05:34:40 EDT 2010 | ppcbs
Hi iv40 Try with NIC ceramic capacitor that was tested in wet process. We hav succeed with these cap after we found some failure with Kemet ceramic Cap which tested in dry test process while manufacturing.
Electronics Forum | Fri Jun 25 13:52:51 EDT 2010 | tate350
Are there any tantalum caps near the BGA? I have seen "wet" tant caps releasing moisture during reflow and disrupting the BGA balls. It may result in missing balls or bridging.
Electronics Forum | Fri Jun 25 14:49:43 EDT 2010 | patrickbruneel
Just skip the squirt bottle and your problem is solved. Cored solder has enough activity for proper wetting. When occasionally extra activity is needed use a fluxpen.
Electronics Forum | Wed Jul 28 08:41:47 EDT 2010 | vetteboy86
I believe we are seeing some wetting issues as we have tried to bake these assemblies ourselves. Our PCB supplier is coming in next week to address the issue. Is there a rule of thumb or formula for determining correct parameters. Thanks
Electronics Forum | Wed Jul 28 09:15:46 EDT 2010 | vetteboy86
I took a pad that did not have any solder flow (wetting issue with pad) and not reworkable with soldering iron, and scraped with an exacto knife. After scraping the pad soldered fine. Any suggestions?
Electronics Forum | Thu Aug 05 14:58:18 EDT 2010 | mikesewell
Smaller and multi-row QFNs will probably require an oblique view/5-axis xray with resolution of at least 1 micrometer and preferably a nanofocus machine. Given the low standoff and small pad size, verifying wetting can be challenging on interior pad
Electronics Forum | Sun Sep 12 12:45:56 EDT 2010 | tony1
Hi there, does anyone experience in NiPdAu solderability dip & look test? I experiencing solder non wet issue on side I/O & also center ground for QFN package. Appreciate someone can offer me a solution. Thanks
Electronics Forum | Tue Sep 14 02:12:22 EDT 2010 | genesan
Hi Sir, Thanks for reply and base on our system the same part are using for 2 model only and the problem occur on both assembly.By the way as feedback it happen on random pin of this BGA only.
