Electronics Forum | Fri Feb 16 08:15:26 EST 2007 | dougs
EC Fix your machine rather than slow down the CAM, on 0603 & 0805 components CAM speed should always be 100% on any of the fuji machines.
Electronics Forum | Thu Jun 01 05:06:10 EDT 2006 | EC
Hi, I facing some 1005 component with poor wetting and look like not enough solder...... Is there any standard solder paste volume requirement. Appreciate all the input.
Electronics Forum | Tue Jun 06 17:00:36 EDT 2006 | pjc
Be carefull of the effect on other components with a 7mil stencil, like fine-pitch devices will bridge more, excess solder.
Electronics Forum | Wed Jun 07 07:53:24 EDT 2006 | RLM
This is true but even the so called reworkable underfill takes a lot of effort. We use a loctite reworkable that requires heat to soften the underfill. Once the component is removed we use acetone and a swab to scrub the pcb clean. This can be very t
Electronics Forum | Mon Jun 05 07:27:45 EDT 2006 | dwelch123
I have one of these and what I usually do is undersize your measurements just a hair. Also , if you are still using the 3500 vision unit you might want to upgrade to the lantern system. Hope this helps.
Electronics Forum | Sat Jul 08 10:44:49 EDT 2006 | larryw
Are you using the old type FV or the new CL Feeders? We place melfs all day long and never ran into a problem with feeder advancement. Sometime the manufactures of the components apply to much glue to the tape which can cause problems with feeder adv
Electronics Forum | Mon Jun 19 21:40:52 EDT 2006 | davef
While underfilling BGA "mounted" on blacked pad boards could improve the reliability by attaching the BGA to the board, you should believe that all components soldered to the board will be affected by the black pad, not only BGA.
Electronics Forum | Tue Jun 13 16:11:06 EDT 2006 | teamcanada
Anyone know of a clean effective way to remove silkscreening from SMT components? We are currently using a laser source removal process and wish to consider alternatives.
Electronics Forum | Thu Jun 15 07:20:23 EDT 2006 | William G.
How are your experiences with stencilling 0201 components on large circuit boards, i.e. 400 * 250 mm ? Will there not be too much mismatch between between stencil and (FR4) boards? If so, would dispensing be a solution? Any other solutions?
Electronics Forum | Mon Jun 19 21:53:10 EDT 2006 | WEEEsted
Try using the loctite(glue) during the top side process. Other way is to separate bigger component IC on the last process (top side).
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