Electronics Forum | Wed Dec 11 01:06:28 EST 2002 | iman
Was visting a production floor, of an SMT assembly line, and saw operators using mechanical pencils to write "process stage identification markings" onto the SOIC packages, after the post-reflow inspection. was wondering if such pencil markings is c
Electronics Forum | Mon Jan 13 17:50:54 EST 2003 | jonfox
I was looking for some good documentation that could nail down some pros/cons of voids, but haven't found any. The biggest issue is if you are going to temp cycle the chips/PCB after assembly. Depending on the cycle, the situation of the test, it c
Electronics Forum | Mon Jan 20 22:39:46 EST 2003 | davef
Hi Stevo, Most paste suppliers say something like, �above 183*C for 45 to 60 seconds.� The problem we have with statements like that is that they seem to assume that the pads, component leads, and solder paste are all near eutectic 60/40 solder. A
Electronics Forum | Mon Jan 27 12:27:03 EST 2003 | ksfacinelli
We have an assembly that requires a number of high density connectors to be placed after SMD. The process will not allow a normal wave solder setup due to the population of SMD comps. We cannot use a selective solder pallet due to profiles. We are
Electronics Forum | Sat Feb 15 15:39:53 EST 2003 | Joe
I have the identical machine and setup as you with the same issue(s). I looked at setting up for N2 but am choosing to retrofit to a standard lambda nozzle setup. If you are soldering bottom side SMT parts or other challenging assemblies, N2 may ma
Electronics Forum | Mon Feb 24 11:02:42 EST 2003 | Claude_Couture
Every time this problem was brought to me, handling was the problem. Make sure to: 1- track the exact place the components are lost, i.e.: visually inspect the pcb before and after each step in your assembly line. 2- if step one does not pin point t
Electronics Forum | Fri Feb 21 00:15:04 EST 2003 | MA/NY DDave
Hi I see David F already gave you some good sources, most of which I recognize. There are or used to be somemore even in your neck of the woods so keep on checking. SMT Plus rings a bell in my head, and check the magazines on the web like Circuitry,
Electronics Forum | Wed Mar 05 05:29:49 EST 2003 | Matherat
Our company does not assemble boards but our customers do and 2 side smd with through hole is pretty common in our experiences.Our customers usually have already decided to glue the bottom side components and fuse them during the wave solder process.
Electronics Forum | Thu Mar 13 15:13:17 EST 2003 | ruggi
That's a good idea...and to add on to it, you could wash after the wave, too--it really doesn't matter. A question about this though--unless your Customer specifically requires "clean", no-clean flux whether it's ugly or not, is permitted by IPC,
Electronics Forum | Tue Apr 01 08:59:06 EST 2003 | rdr
Hi all, I've got a question that hopefully someone can provide insight. We have a gold immersion assembly that we believe is experiencing fractures or non wetting on a certain BGA. To be sure that it is a fracture and not a wetting issue I would li
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