Electronics Forum | Wed Jul 01 10:49:01 EDT 1998 | Richard Jackson
I'm having a problem getting good reflow on gold sufaced boards. The profile looks good and I have adjusted it both hotter and colder and adjusted the various times ( soak, reflow ) to no avail. What realy gets me Is that a month ago we built some go
Electronics Forum | Mon Jun 29 13:38:20 EDT 1998 | Russ Miculich
| looking for help with fine-pitch printing for what would be the best settings for printing speed, squeegee pressure, seperation speed. | thanks for you time Brian: As Justin says - the issues are many. However, a good start would be to run at 0.75
Electronics Forum | Fri Jun 26 19:59:07 EDT 1998 | Scott McKee
| can any body help on assembling straddle mount connectors on to a board? for information on the connector - it is a berg micropak connector 1. You need a fixture to insure the pins don't bend while inserting them on the board, coplanarity is a re
Electronics Forum | Wed Jun 03 13:51:57 EDT 1998 | Dave F
Hello: BACKGROUD: SMT components soldered on the top-side of boards that also require wave soldering have the potential to reflow during wave soldering. Reflowing these components during wave soldering is not good. It can cause cold joints, opens
Electronics Forum | Thu May 07 12:29:17 EDT 1998 | Rob Williams
I am running a board that is .062" thick and has components that over hang the edge of the board by .090". I have bottom side smt components (chip caps and resistors only) and use the turbulent wave to help solder the components. The problem I am h
Electronics Forum | Fri Apr 10 15:59:51 EDT 1998 | Justin Medernach
| We are having a bridging problem with SOIC 14,16 and 20 pin devices during flow solder of the bottom side of our boards. This bridging occurs about half way up the lead between the board and the body of the IC. The chip parts are no problem. The
Electronics Forum | Fri Mar 27 02:05:26 EST 1998 | Jon Gruett
AS the previous have stated there are several ways to get the BGA's off the board. Let me first ask you a couple of ?'s. 1)Are you concerned at all with the damage to the baord or the BGA? 2)Are you eventually going to need to consider the reattac
Electronics Forum | Mon Feb 23 23:42:11 EST 1998 | Mike
| Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. Depending on your rework station,Useing
Electronics Forum | Mon Mar 30 16:29:31 EST 1998 | Tony Arteaga
| | Can anyone give me any info on the effective removal of BGA's? I need to be able to take a variety of BGA's off boards quickly without creating pad damage. I am not yet concerned about the re-attach process. | Depending on your rework station,| U
Electronics Forum | Fri Apr 03 03:41:04 EST 1998 | Frank J. de Klein
150 secs. On bilayer boards (Cu only at top and bottom) you can typically not reach differences top to bottom bigger then 35-40 C. For multilayers however, the maximum is 15-20 C. If you actively cool a multi- layer at the bottom during the 2nd pass,
