Electronics Forum | Wed Aug 24 10:04:48 EDT 2005 | davef
Try; * CS Hyde; 1351 N Milwaukee Ave, Lake Villa, IL 60046; 800-461-4161 / 847-395-0325 Fax: 800-441-8063 / 847-395-0535 * CGS Tape, 12-270 Timberbank Blvd, Toronto, ONT M1W 2M1, CA; 416-561-9168 Fax 416-773-0262 http://www.cgstape.com
Electronics Forum | Thu Aug 25 09:56:39 EDT 2005 | cyber_wolf
Can anyone tell me what he overall height of a CP6 board support/backup pin is supposed to be? They don't sell the back up pins as an assembly. It looks like you have to buy them piece by piece and set the height yourself. Thanks
Electronics Forum | Thu Aug 25 15:02:20 EDT 2005 | mmjm_1099
All, I was wondering if anyone out there has designed their own feeder calibration station. I was looking at some of the calibration ones out there and they don't look to intense to make. Give me some feedback on the negatives as well to making this.
Electronics Forum | Thu Sep 01 12:55:39 EDT 2005 | bhu
I assume you mean Dr. Jenny Hwang--I attended her lead free seminar and found that most of her info is a good place to start. One of the debates about her work is whether bismuth should be used in any formulation. Many of the paste manufacturers di
Electronics Forum | Thu Aug 25 19:37:18 EDT 2005 | Dave
Hi Mark, Check out Heller's white paper link for a study done with a PCB in line with thick and thin aluminum plates to measure repeatability and delta T with loads of large mass materials. The result was less than 1 degree with their oven due to i
Electronics Forum | Sat Aug 27 12:55:11 EDT 2005 | Mark
Have not researched vapor phase reflow ovens. Thought they were no longer manufactured (outside of Europe). Can you recommend a manufacturer based out of US? Never seen one in production, only heard of these ovens being widely used up to early 90'
Electronics Forum | Mon Aug 29 03:38:34 EDT 2005 | GS
Just few brand names of VP reflow machines: - ASSCOM http://www.asscom.de - epmIBL http://www.epm.ch One of the the Heat Transfer Fluid used with today Vapor Phase Reflow(condensation) technology is the GALDEN that you can select according to
Electronics Forum | Fri Aug 26 10:02:31 EDT 2005 | S vaughan
Hello, Can anyone comment on the implications of small sodler balls under a leadless device such as LLP with a centre thermal land. I believe that we did not make a good reduction and the paste squeezed out of the centre land and balled up under the
Electronics Forum | Fri Aug 26 17:27:48 EDT 2005 | saragorcos
Hello there, Most probably, since the solder balls are entrapped, it is a process indicator, but refer to IPC 610-6.5.3.1 on Excess solder / solder balls / splashes - it really depends on what class you are manufacturing, and the minimum electrical c
Electronics Forum | Wed Aug 31 12:49:04 EDT 2005 | kmeline
I have been having the same problem with the LLP. I have three stencil I have done reduction on. The first I went by the manufacturing recommendations. The last two I have done more reducing for the thermal pad. The last one was at a 20% reduction an
.gif)
