Electronics Forum | Thu Apr 01 21:18:31 EST 1999 | Chris Kelly
Glenn, There are both very good VOC-Free fluxes as well as alcohol based fluxes out there. This should be your primary focus if you are so lucky as to have to opportunity to actually select a flux! The use of nitrogen will benefit any no-clean pro
Electronics Forum | Mon Mar 22 15:05:52 EST 1999 | Scott
| | | | Looking for a company that makes a small batch reflow oven. Not a belt-style convection oven, but a cabinet style that can 125 c to 150 c. | | | | | | | | Thank you | | | | | | | TRY GE I HAVE ONE AT HOME THAT COOKES PRETY DARN GOOD. And i
Electronics Forum | Fri Mar 12 20:19:46 EST 1999 | Dean
| AVX and a few other companies make these chip transient voltage suppressors (TVS) parts that are a real *PAIN* to use. According to AVX: | "Due to the semiconducting nature of the doped Zinc Oxide (ZnO) ceramic material, SMT TransGuards ar
Electronics Forum | Sat Jan 23 13:29:40 EST 1999 | Earl Moon
| Hi Everyone, | We plan to build, for reliability/experimental/research purpose some CSPs (namely Tessera microBGA 46-I/O 0/75mm pitch and TI 64 I/O 0/8 mm pitch). the various factors that we plan to evaluate are the reliability and assembly concern
Electronics Forum | Mon Dec 14 14:16:52 EST 1998 | Clifford Peaslee @ SMTnet
| | While trying to access this web site you sent over 10 "cookies" A bit overdone, isn't it? | | | Ed, | lighten up, it's the holidays! Pack up the cookies and hand them out to your friends and loved ones.Eat all you can cause around here there a
Electronics Forum | Mon Oct 26 16:01:33 EST 1998 | tom Gervascio
| | I need some info on how to stop the bridges I'm having on | | radial and axial parts that are in the same place on every board. I'm also having problems with sot-25 bridging. I'm using a Electrovert E-pak. I tried leveling the machine,solder pot
Electronics Forum | Thu Oct 22 14:39:22 EDT 1998 | Chrys
| My company is looking for higher density for card layout. One suggestion has been locating active components packaged in SOT's and SOIC's on the B-side of the card. This in turn will require wave soldering of the above mentioned components. When I
Electronics Forum | Thu Sep 17 10:45:27 EDT 1998 | Justin Medernach
| We have problems with voids when we solder lids to | ceramic flatpackages. | The sealring of the package is gold(100 micro inches or 2.5 micro meters)with a underlayer of Nickel | The solder is attached to the lid (preform) and the solder material
Electronics Forum | Tue Jul 28 02:28:48 EDT 1998 | Bob Willis
The causes for solder on gold are: Paste wash offs Dirty stencils Dirty under stencil cleaning cloths/no solvent Poor handling The most common reason is wash offs when there is a couple of balls left on the tabs and they reflow. With correct profile
Electronics Forum | Tue May 26 15:49:05 EDT 1998 | Earl Moon
| | We currently bake plastic SMT parts in accordance with the IPC guidelines for moisture sensitive parts. Because we have double-sided boards that are subjected to either an aqueous or semi-aqueous cleaning process, we do a 24 hour bake at 125 deg
