Electronics Forum: stencil (Page 441 of 572)

Stencil Printer comparison

Electronics Forum | Wed Nov 20 16:27:15 EST 2002 | pjc

FYI: MPM does in fact offer alternate board support tooling than the vacuum box system. They have the X and Y snugger tooling, which clamps the board and uses magnetic support pins. If you are looking at a used UP2000, check to see what tooling it ha

Stencil Printer comparison

Electronics Forum | Sat Nov 23 11:16:05 EST 2002 | mark

Transition Automation is offering a unique offline tooling system, which definetely improves the mpm machines compared to dek. Considering the big cost gap between used mpm and dek machines, if you buy mpm, and buy transitions instant fixture upgrad

Stencil Printer comparison

Electronics Forum | Tue Nov 26 09:19:29 EST 2002 | pjc

MPM UltraPrint 2000 2D Inspection Times: QFP 256 pin 16Mil pitch is 7.5 seconds BGA 225 ball 20Mil pitch is 1.8 seconds Find out the DEK times for these devices. Any UP2000 of 1995 mfg. date oand on can be upgraded to the latest software. Concer

Solder Preforms

Electronics Forum | Tue Nov 19 10:25:45 EST 2002 | mcmilse

I have a question abut flux and solder preforms. We build some assemblies that have deep pockets in which we use solder preforms and add flux before placing parts and then onto reflow. I was wondering if anyone knows anything about how much flux sh

Fine pitch paste release problems.

Electronics Forum | Thu Dec 19 13:10:49 EST 2002 | gramsey

Really? Where does it say that? I have had the opposite experience and 3.2.2 from the IPC-7525 states for square or rectangular apertures - "Having a radiused corner for all apertures can promote stencil cleaning". It actually recommends circular ape

Ekra E5 cleaner dispenser problem

Electronics Forum | Mon Jan 06 11:04:39 EST 2003 | slthomas

Bummer. Are you using the EPAC stuff that they recommend, or something else? We used IPA for a while, then changed to a run-of-the-mill stencil cleaning solvent (aliphatic hydrocarbon based, like the EPAC solvent) that's a lot cheaper and does the

BGA PCB Pad size

Electronics Forum | Fri Jan 17 09:38:20 EST 2003 | Grant Petty

Hi, We have a BGA that uses .4mm diameter PCB pads on the BGA itself, however we have decided to use .5mm pads on the PCB, to help paste release from the stencil. Is this a bad thing, having different size pads on the PCB compared to the BGA itself

Stenciling chipbonder.....

Electronics Forum | Fri Jan 24 21:54:36 EST 2003 | jonfox

Good comment about the "passthrough" CAMALOT. I like that one. About the beer...when I was in field service, I was a microbrew nut, and still one of my favorites is Fat Tire from the Boulder, CO area. honorable mentions out West are (yes) Pyramid

Placement Equipment

Electronics Forum | Fri Jan 24 17:07:55 EST 2003 | razan3

This question is like asking what kind of boat should you buy. Depends on what you do with it.... I would ditto the CP40. Good discrete placer and very reliable. Your PCB Design, Stencil, Reflow Oven and Paste selected are just as critical to you

Voiding in CSP Ground pad

Electronics Forum | Fri Feb 07 15:17:14 EST 2003 | MA/NY DDave

Hi I am pretty sure it isn't the pad that is causing the problem. To me it seems like those via holes through the pcb either to an internal plane or to the other side. I can imagine creating an interesting stencil to accomodate the vias yet you are


stencil searches for Companies, Equipment, Machines, Suppliers & Information