Electronics Forum | Wed Feb 20 17:53:02 EST 2002 | djarvis
I certainly fit both citeria - 6'4" with a face like a bashed crab. I think I'm the one on the far right in white in the top picture at http://www.delicate.com/audio.htm which I believe is us at Mudd Island, Memphis in 1983. Alisa and Steve - now I
Electronics Forum | Wed Feb 20 20:20:29 EST 2002 | davef
I saw Bradbury's last two races. Luck comes around. What do they say? "Luck is the residue of hard work." Two things: 1 I know what a smashed crab looks like and I cannot find anything like that on the link you gave. 2 All of that for a longneck
Electronics Forum | Wed May 01 12:05:44 EDT 2002 | peterson
FMEA, when used correctly, is an excellent tool. The best thing about it is that it holds INDIVIDUALS accountable. The meeting cannot be closed until specific people (usually process types like me!) are assigned specific duties. I agree with Dave tha
Electronics Forum | Mon May 13 10:16:53 EDT 2002 | pjc
After bar-coding or manual data entry the data is in the Mydata database. The data is not stored in the feeder but in the database. The database links the component data to a serialized feeder and to a PCB s/n or production batch code. The machine so
Electronics Forum | Tue May 14 20:43:55 EDT 2002 | davef
I feel as though I�ve just walked in to a bar, where everyone I was supposed to meet has been drinking for 3 hours. First, the volume of water displacement thing doesn�t make sense, as others have commented. Second, I believe Dave Robbie wants meas
Electronics Forum | Wed May 22 12:51:15 EDT 2002 | cyber_wolf
I cannot tell you about the MY-9's , but we have had a MY-12 machine w/i hydra for about two years. We run it pretty steadily on three shifts including a weekend shift. It is a very reliable machine, BUT it is very picky about maintenace. You need to
Electronics Forum | Wed May 29 14:42:53 EDT 2002 | jaltland
I have another question about bga's and stencils. We were told by a manufacturer to use .012 square apertures for .009 dia balls. The original pick & place and reflow goes pretty well (over 95% good), however when we have to select components on th
Electronics Forum | Sat Jun 15 22:49:23 EDT 2002 | edahi
well as usual this for flip chip however, this application uses ceramic substrates and the nearby area in which the splatter land on is the marking area (gold pad). We cannot hide this because the package is completed bare die, meaning no heatspread
Electronics Forum | Sun Jun 23 23:23:25 EDT 2002 | beldorian
First question - I am making an assumption that after "de-pop'ing" a BGA prior to socketing the thing to test it, the best known practice is to re-ball the thing. Is this an industry standard? Second question - If it is an industry standard, does a
Electronics Forum | Wed Jun 26 11:13:09 EDT 2002 | robbied
Can anyone help? Our Solder bar suppier is discontinuing the Sn63 Pb37 solder that they currently supply us. Another company has offered us a 'direct replacement' which is their own Sn63 Pb37 solder bar. The only problem I have with this is that the
