Electronics Forum: /02 (Page 442 of 1283)

Epoxy on bottom of SMT component

Electronics Forum | Mon Dec 03 02:44:27 EST 2007 | shy

Hi Loco, If i cover all the SMT component with peel off before reflow, it'll increasing downtime at my production site. To reduce the downtime, we had idea to add in the glue for component package 0805 and bigger.

Cu% spec for lead free HASL surface finish

Electronics Forum | Wed Nov 28 02:43:00 EST 2007 | philip_yam

Hi all, For leadfree HASL finish, is there any specification or guidelines for contamination level, esp Cu% to refer? How can we ensure the HASL finish composition is reliable for assembly? Thanks..

Fiducial replacements?

Electronics Forum | Wed Jan 02 10:24:07 EST 2008 | Paul M.

No Chunks, I did not tell him to "stick it", yet. I've decided on a new way of handling this IDIOT. I'm gonna try some passive-aggressive techniques. You know. Sarcasm and manipulation? Will see how that works.

Amkor Fusion Quad

Electronics Forum | Mon Feb 11 12:20:05 EST 2008 | stevek

Amkor must be really pushing this. Two different ASIC suppliers are proposing it. Looks like if I can't say there is a known problem, we'll get it.

agilent SJ 50 series 2 series 3 difference

Electronics Forum | Sun Dec 02 08:14:27 EST 2007 | accurex

Can any one guide what is the difference between the Series 2 and Series 3 of agilent aoi sj50 system.

Pin Through-Paste with Lead-Free

Electronics Forum | Mon Dec 03 16:05:02 EST 2007 | ed_faranda

Anyone doing this, successfully in a robust process without any touch up required? Is it even possible? I use to do with in a leaded process.

Pin Through-Paste with Lead-Free

Electronics Forum | Wed Dec 05 02:57:21 EST 2007 | work288

Hi, We had using PIHR process for about 5 years already, if you need some info data do drop me a mail at work288@yahoo.com.sg . Hun

pump print stencil

Electronics Forum | Thu Dec 06 02:45:09 EST 2007 | mun4o

hi, we use pump print stencil and have problem with cleaning.we clean the stencil handling, using zestron301, but in the holes stay adhesive.Take a test with ultrasonic cleaner but resalt is not good.

Baking components at 70 degree

Electronics Forum | Thu Dec 27 02:57:49 EST 2007 | gersla

17 mm x 17 mm or any stacked die package). What is stacked die package? Can you send me a picture of such a component? Thank you in advance,

BGA 0.5mm pitch Ball 0.3mm assembly and soldering.

Electronics Forum | Wed Jan 02 15:32:27 EST 2008 | shrek

HA-HA-HA... Krikies. What are ya mate? A slavakian?


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