Electronics Forum | Fri Mar 29 09:08:03 EST 2002 | caldon
Barcode!! The Siemens machines can have bar code Options added.On the Siemens Machines the bar code S/W is a little archaic. In theory You would have a bar code on a reel of part and a barcode on the feeder location (They are the black codes on the s
Electronics Forum | Mon Apr 01 12:07:25 EST 2002 | slthomas
* What material are you using? Loctite 3609 * What is your cure profile? In excess of the 90-120 seconds at 150C that Loctite recommends. * Dot dimensions and tip? 27g. conical tipped needle for the 0603's. I started with a 14 mil dot which loo
Electronics Forum | Tue Apr 09 16:25:28 EDT 2002 | clarkk
Alan, You're right, mass inspection after assembly won't work. The inspectors will miss 25% (or more) of the defects, and the boards will be reworked before SMT operators can properly define defects and their sources. The company I work for tends to
Electronics Forum | Thu Apr 11 20:35:22 EDT 2002 | davef
Messy. Messy. Messy. Consider gluing these components, until you control your process. It is unclear to us that a single factor drives these defects, but multiple factors that need to be tuned to work well together. PAD DIMENSIONS * Some SM-782 pa
Electronics Forum | Wed Apr 17 23:00:11 EDT 2002 | lysik
A DEK 265 Mark 1 is an old system. That does not mean that it does not work well. It is a very good system. It has however past it's 7 year support life. As far as a person that works for a OEM working on your machine there is no law that says he or
Electronics Forum | Fri May 24 11:46:34 EDT 2002 | tmv
Lot's of good discussion in this string...but I think we've missed a few points. First off...turret machines are more than capable of handling the smaller component sizes (in fact, they are the best)...Machines like the SANYO TCM-3000 or Universal 47
Electronics Forum | Mon Apr 22 20:55:00 EDT 2002 | ianchan
Hi, this is not really a technical solution, just a feedback. we too have a model series using the same WS paste type. it gives a dull solder joint with white residue that can be marginally removed after post-DI water rinse (ie. not 100% removed).
Electronics Forum | Fri Apr 26 20:11:51 EDT 2002 | stefwitt
Ian was quite right, mentioning the Nitto patent. It is Pat# 4,820,369 from April 1989. The idea is great, but there are quite some hick-ups in practise. P.S. The reasons for the difficulties with the �cover tape curl� are easily explained. Try to
Electronics Forum | Tue May 14 21:07:03 EDT 2002 | ianchan
Hi mates, Yes, the lighter mass is a valid reasoning. in addition to the "lighter (mass) than thou" point of view, 1) the first reason for mounting active Parts (eg. IC, QFP, LGA...) is to minimize the temperature exposure of the Parts to a single
Electronics Forum | Wed May 15 22:23:38 EDT 2002 | ianchan
Hi mates, need some help to resolve a thumb-twine situation. As a high-mix, low volume prototype build house, we always conduct a first article inspection (FAI) on every model setup conversion in the SMT production Lot run. we do this FAI by mounti
