Electronics Forum | Tue Sep 11 19:54:52 EDT 2001 | gsparka
HELLO. SMTNETERS there is no company in high mix low volume system in our contry so . what is the best way to calculate the capa. of smt line in high mix low volume. & what is the general way to get the defect rate to evaluate the smt line(or sm
Electronics Forum | Thu Nov 22 12:56:12 EST 2001 | tony_sauve
Thanks for the comments & suggestions. Here's some info garnered from a telecon w/the PCB Fab house: -the blind via's extend from layer 2-17...this was a revelation. The info from our customer was that the via's only extended down 2 layers. Did I men
Electronics Forum | Sat Aug 10 06:38:25 EDT 2002 | jojojameson
Dear Freinds, We are having 18000 sqfeet airconditioned space for pcb contract manufacturing.We had chipschooters,through hole machines & fine pitch placement machines with international standard.In addtion we had clean rooms & wire bond facilities.W
Electronics Forum | Tue Apr 02 22:58:10 EST 2002 | davef
Whatever I've said, my intent has never been to insult you. Smack you yes, insult you no. True, you never said the word �strings� but you did say � * �� shouldn't I be able to expect enough green strength from my epoxy to hold 0603 caps in place wi
Electronics Forum | Mon Apr 29 05:25:13 EDT 2002 | ianchan
Hi, we do Sn plated I/O pinning insertion into Ni/Au thru' holes. no problems here so far, as we cater for the "interference" (fit-allowances) of the I/O pin into the thru' diameter, via improved PCB thru' hole designs. before this cater/considerati
Electronics Forum | Tue Jun 04 17:10:13 EDT 2002 | davef
First, �flash gold� is very loose language. It means different things to different people. �Flash� gold is a thin coat of immersion gold. Imm gold self-limits at ~0.3um[12uin]. And fabs put-down �flash� prior to electroplating thicker gold for wi
Electronics Forum | Wed Oct 23 16:17:17 EDT 2002 | nwyatt
CSP is similar to BGA process in that you need to undergo a reflow process to properly solder the chip. Also, a soak period is desirable to promote outgassing. You do not need nitrogen. We are building CSPs in a regular convection oven without n
Electronics Forum | Tue Jul 01 17:38:24 EDT 2003 | jartman
I've faced this several times in the past, and the only real solution is to wirebond before SMT assembly. Everything leaves a residue, and trying to clean a residue off later is basically hopeless. This may require some trickery in your SMT process
Electronics Forum | Wed Oct 15 09:53:01 EDT 2003 | markhoch
These boards also were above liquidus for 75 seconds, and the customer puts the boards thru extensive thermal shock and stress testing. An Alpha Applications engineer told me that because the boards were above 183 degrees for 65-75 seconds that the i
Electronics Forum | Tue Nov 11 16:01:09 EST 2003 | KSimpson
Adam, As for stripping the boards.. get them right to start with. Believe me you don't want to clean them. If you have to remove the coating most conformal coating brands offer a removal agent that has been tested on most all component ranges. IF yo
