Electronics Forum: laser cut stencils (Page 45 of 57)

QFN84 Solder Printing Issue (QFN with Inner LGA Pad)

Electronics Forum | Wed Nov 15 12:52:21 EST 2017 | georgetruitt

IMO – Look into nano-coatings for your stencil and radius all square apertures This should help out with solder paste releasing from the stencil helping with insufficient solder QFN LGA aperture design, try a stencil cut with a few different apertur

Nordic aQFN73 stencil design

Electronics Forum | Mon Apr 09 12:52:00 EDT 2018 | slthomas

We are about to do a second iteration of something we struggled mightily with last time and I'm hoping to at least make a step in the right direction. There are 12 of these parts on the board and virtually all of them required removal and replacemen

Stencil design for flex-rigid PWB

Electronics Forum | Wed Sep 15 22:01:34 EDT 2004 | rohman23

We've had a few problems with printing a flex-rigid PWB, and I'm hoping some of you could throw some opinions/suggestions my way. Our PWB is about 8" x 11" divided into two parts (side A & B) by 2 wide flex cables. Each of these flex cables is ab

Board support issues

Electronics Forum | Tue Sep 18 13:58:01 EDT 2001 | ert002

50%) only over the appertures where there was poor support. Most prints took 2 knead strokes to print OK, but this caused fine pitch leaded devices to almost short. stencil had to be be wiped after kneading. 2 similar devices with exactly the same

Re: Squeegee Speed

Electronics Forum | Fri Feb 19 13:54:22 EST 1999 | Tuffty

| Hey all- | | My question is this: My stencil printer operator has said that he has to | wipe our 6-mil stencil each pass to get the paste in the 20-mill pitch | aperatures for a QFP to release well. We are using Amtech NC-559 type 3 | paste with

Re: no-clean vs. water soluble

Electronics Forum | Thu Sep 14 11:39:59 EDT 2000 | Steve Thomas

Ahhhh, Dave, I'm glad I can still count on you for some real cutting edge info. yuck, yuck. Believe me, there's a lot more information available on how to resolve no-clean issues than there is on how to keep this stupid board wash/DI/Stencil wash/

Re: paste release from stencil - results

Electronics Forum | Sat Nov 27 10:16:38 EST 1999 | Steve Thomas

The new design resulted in much better release characteristics. We are quite satisfied. By the way, he says he can cut dead nuts 90 degree walls on the apertures, or traps. I didn't ask what the wall angle was, nor have I seen any recommendations,

Hirose Connector Installation........

Electronics Forum | Wed Aug 24 22:53:34 EDT 2005 | mrduckmann2000

We have a customer that is using the new Hirose connector p/n df30fc-40dp-0.4v. The connector has lead spacing of .4mm. I beleive that if I have a stencil cut to 2-3 mil I should have enough solder paste to solder the connector to the PCB pads. Ho

Should I panic over .5mm pitch BGA?

Electronics Forum | Wed Aug 31 00:50:59 EDT 2005 | grantp

Hi, We have a new part we need to mount, and it's a .5 mm pitch BGA with .3 mm diameter pads. That's a lot smaller than we have done before, and we currently use 1 mm pitch BGA's with .5 pads. Has anyone does .5 mm pitch BGA's and what needs to be

CSM 84V: damaged parts (mmelf, 0805) during placing.

Electronics Forum | Tue Dec 06 18:29:45 EST 2005 | darby

You may also wish to check the speed controllers for both descent and ascent. The higher the ascent speed the more force the jaws close with. It can be difficult to achieve a "good" nozzle placement height as this is mechanically set and your lowest


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