Electronics Forum | Tue Feb 11 13:12:25 EST 2003 | Jim Mills
Use a PCB fab house that is capable of "Conductive Via Filling" is the way to do it right. A conductive epoxy is used to fill the drilled via PRIOR to final plating. After final plating, the surface of the "Filled Via" will appear to be the same as t
Electronics Forum | Fri Aug 05 12:13:28 EDT 2005 | spommer
As part of our conversion to lead-free, I'm redesigning a pcb that had switch contact patterns screened on the board using carbon ink. On the new board, I plan on using the ENIG process and having the switch contacts be patterns of copper with the n
Electronics Forum | Wed Aug 09 09:54:36 EDT 2006 | russ
Use ENIG, plated finish will be too thick and make for a brittle joint. ENIG is self limiting so this condition cannot be present. To ensure that the bond is strong for BGA you must ensure that process is under control. The correct reflow profile w
Electronics Forum | Thu Sep 20 15:05:20 EDT 2007 | jax
You can specify the prepreg thickness in the stackup. Once you have specified it somewhere, make your PCB manufacturer build to it... and prove it through cross-section analysis. Depending on the Board cost, we require a cross-section and analysis d
Electronics Forum | Mon Mar 17 07:45:27 EDT 2008 | jackson
Hi SWAG, Bridging most contributed is from printing set up which is the parameter setting as well the board thickness setting. I would suggest you may check the parameter setting which mainly the squegee speed, stencil gap between PCB contact, print
Electronics Forum | Thu May 29 14:35:37 EDT 2008 | rdmundo
Gents, We've been using a round 1:1 aperture for a 5 mils thickness on our stencil design on 0402 and recently, IPC guidelines recommend oblong, homeplate or reverse homeplate. I believed the PCB pad for 0402's area within the recommended size/dimen
Electronics Forum | Thu Apr 02 14:58:49 EDT 2009 | vladig
Hi Peter, Have the plating thickness checked with XRF. If the layer of Au too thin, then Ni can diffuse all the way through it during the first run and the surface won't be perfectly solderable for the second side. it might also have a thin layer of
Electronics Forum | Wed Feb 04 08:00:30 EST 2009 | milroy
Hi, It depends on the stencil thickness, aperture size and the component footprint. For exampl if you have a PCB with QFP,CSP,QFN & BGA parts then this underwiper is not useable because you will still find solder cream deposits in the apertures aft
Electronics Forum | Tue Feb 16 21:29:18 EST 2010 | actioncontrols
I predict you will have no problems with your soldering. Remember that all plating is only a few microns thick and quickly washed away by the molten solder. We have used white tin, immersion gold, OSG, etc. for quite a while with leaded solder and
Electronics Forum | Fri Apr 13 10:34:36 EDT 2012 | bandjwet
1 thickness therefore a DEFECT Does defect violate Min Elect clearance-If YES then defect Make sure you have a dialogue with customer on this one because it will be a repair. The repair itself can be done per IPC7721 procedures. Bob Wettermann B
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