Electronics Forum | Thu Feb 10 11:29:19 EST 2011 | patrickbruneel
If you search the documents for tin whiskers it’s getting very interesting. Also you can find in the report that lead-free (SAC) solder is used. http://www.nhtsa.gov/staticfiles/nvs/pdf/NASA-UA_report.pdf This report also confirms that the board
Electronics Forum | Wed Aug 24 12:37:38 EDT 2011 | hussman
Hello all, We just got some board back from thermal shock and we found that several of the 2512 resistors opened up. Actaully the solder joint cracked away from the board. All other coponents look great. Boards were good before test. 10 layer bo
Electronics Forum | Tue Nov 15 22:27:21 EST 2011 | Jacki
Hi Zaza Thanks. Again, very appreciate if you advise me where I can get the SN100C solder bar that is water soluable. Now I'm checking Nihon Superior(Singapore) whether they have or not. As our customer's preference, we have to use the watersoluab
Electronics Forum | Wed Apr 18 10:05:24 EDT 2012 | dyoungquist
We started with SN100C from the very beginning when we purchased our selective solder machine. It has been working well for us. I can't speak to what happens when changing over to it, but I've heard of many companies using SN100C for selective sold
Electronics Forum | Mon Sep 24 18:03:43 EDT 2012 | rmazenha
Hi, i am using AIM 264-5 No Clean flux for soldering alpaca pieces on PCB boads, but i am having problems: poor filling and no solder. I am using SAC 305 lead free solder. I have tried to change flux pressure, time, ammount as well solder speed an
Electronics Forum | Fri Mar 22 18:16:44 EDT 2013 | vpham
We are trying to use this high-temp solder paste due to a very special process, but we run into tombstones on chip caps, 0402 and 0603. We don't have this problem if we use regular SAC305 solder paste. If you have experience with this type of solde
Electronics Forum | Tue Jun 11 14:16:03 EDT 2013 | bandjwet
We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the undersi
Electronics Forum | Tue Jun 11 14:21:35 EDT 2013 | bandjwet
We are involved in a project for microBGA SAC rework. The pitch is 0.4mm and the devices are underfilled (softening 150C). The underfill comes off fairly easily but the pressure underneath the package as the underfill softens pushes up on the undersi
Electronics Forum | Thu Jun 27 23:49:40 EDT 2013 | cedric77
I had a solder paste SAC305 T4, with flux loading of 11.5%. After retrieivng out from fridge(5deg) after 48hrs, the paste turn dry (like dry mud? and after double checking the flux loading it becomes 12.5%. Has anyone ever experience this or any opi
Electronics Forum | Wed Aug 21 17:03:13 EDT 2013 | hegemon
I think your pre-heat temp is a little low for SAC 305 Soldering. Especially with a Pallet. You might want to try to add some time and temp to get the PWB itself preheated up to 150-160C. That should help with the barrel fill. Make sure your board
