Electronics Forum | Mon Jan 12 13:15:18 EST 1998 | Yves Trudell
In general terms, guidelines for moisture sensitive devices (MSDs) say that you shouldn't put a component through reflow after it has reached its exposure limit with respect to moisture absorption. When using an automated hot air rework tool to remo
Electronics Forum | Tue Dec 30 20:31:11 EST 1997 | Jon
I suggest that you look at a few things: 1) The SMD pads may be too small for the part. Try to conform with the IPC standards in pad design. 2) The parts may be misplaced during the placement process. Tweek the placement program and if that doesn'
Electronics Forum | Mon Dec 08 09:25:02 EST 1997 | Scott McKee
| I would like to hear from anyone producing high mix (~200 modules) with low volumes (5-2000 per year) using an automatic line running lot sizes in the 5-50 range. We are engaged in an investigation to invest in this capability. A view into the or
Electronics Forum | Thu Aug 09 12:36:26 EDT 2001 | Michael Parker
Adam- Mikie here. I too am placing 2 PBGA sockets on an assembly but they aren't mirror imaged. Thanks to the SMT Gods for that one. You say you added more paste to solve for open solder. Do you have x-ray? Were the alignments perfect? Also the part
Electronics Forum | Thu Sep 06 13:19:36 EDT 2001 | mparker
The main criteria is at what frequency is the RF operating? If it's in the microwave region, forget no-clean. Low frequencies - 0 to 100 MHz, probably ok. Beyond that, it's application specific. Depends on components used and circuit design. The p
Electronics Forum | Mon Sep 17 16:03:13 EDT 2001 | jschake
The results from an experiment comparing 27 different combinations of pad dimensions concluded that the pad design with 15 mil pad length, 12 mil pad width, and 9 mil pad separation produced the best assembly yields. A 5 mil thick laser cut stencil
Electronics Forum | Wed Sep 26 16:33:45 EDT 2001 | davef
Your first inclination is correct. You should start by asking your friends and colleagues on SMTnet: * What is that SMT or MEMS or COB etc.? * What are the considerations when processing a SMT or MEMS or COB etc.? We�re one smart crew that won�t st
Electronics Forum | Tue Oct 09 20:30:25 EDT 2001 | djarvis
Thank you all for your input. We didn't get the oven and if we did I decided in the short term to just turn it around and run it as a belt mesh oven - the next line we buy runs it's conveyor to suit the oven. Hi to you Marc, it's been a few years. Yo
Electronics Forum | Mon Oct 08 23:17:48 EDT 2001 | Brad Arnold
We are trying to produce a PC Card bus assembly with a 672 pin BGA on one side. These pcb's are .015 thick. I believe the ball pitch is .5mm. The pcb's are plated with white tin. The pcb's are in a 1 X 3 array. We had 2 plates with appropriate cutout
Electronics Forum | Wed Oct 10 13:49:12 EDT 2001 | stepheno
I recently started at a new company. They have a variety of bare PCB's and most have aprox. 20 variations. Maybe about 1/3 of each board on average are non-populated locations. They buy one stencil for each PCB but then use scotch tape to block of
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