Electronics Forum: sided (Page 444 of 507)

First Article Inspection

Electronics Forum | Sun May 19 21:01:51 EDT 2002 | ianchan

Hi mates, we only do a double side tape sample for 1st pcs output, buyoff the location vs P/N, and orientation. we can recycle use of "A-items" eg. IC... once all this is affirmed, we mass run the rest of the Lot size, via full SMT line configuratio

gold connectors

Electronics Forum | Fri May 31 08:51:09 EDT 2002 | zanolli

Hello Dave, As related to connector mating interface, fretting corrosion is the oxidation of the contact points, causing high resistance across the interface. Fretting corrosion is caused my micromotions in the interface exposing the metalized conta

Tombstoning

Electronics Forum | Fri Jun 14 09:15:02 EDT 2002 | edahi

DaveF, Yeah you got that right...because the initial stages of the project, the products would only attach 1 passive (capacitor) hell when things got too cheesy they wanted to attach 20 caps or so....this is not like board assembly, this only 1 Flip

Systems for Solderability-tests

Electronics Forum | Wed Jun 26 08:54:53 EDT 2002 | davef

it has a lousy gage. * Solderability testing machines from different suppliers produce dissimilar results. * Tests don�t well represent in-use. For instance, how does one test the solderability of a BGA? [Ooo, ooo. I know the answer. => For BGA and

PCB baking for rework

Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette

The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release

Super M.O.L.E or Slim KIC 2000 for oven profiling?

Electronics Forum | Tue Jul 30 11:30:23 EDT 2002 | slthomas

We currently use the SuperMole and generally speaking it's a nice tool and gives us the information we need. The software could use some work, though. When you create a file for a new profile, you have to input a "time above" temperature for your

void on BGA Ball due to via on BGA pad

Electronics Forum | Fri Aug 16 10:00:03 EDT 2002 | davef

You have a very bad situation. It�s tough for the gas, flux material, er whatever to escape when the BGA is sitting on top of it and the blind via is blocking it from the other side. Obviously the vias should have been: * Placed on the edge of the

Repair of FR4 double-sided pcb

Electronics Forum | Thu Aug 22 22:10:26 EDT 2002 | davef

Ooooow! �Can it be fixed?� Good question. How BAD did you damage it? * Since you are asking this question, I am NOT inspired by the potential that you have the skills to fix the board. Go Jeff Ferry�s site at Circuit Repair Center [If you can�t f

PCB's for oven profile testing

Electronics Forum | Mon Aug 26 20:33:50 EDT 2002 | davef

Not as such. Generally, people tailor their profiles to produce glam solder connections on their boards. Search the fine SMTnet Archives for discussion on the factors affecting solder reflow recipes. What is the best way to get these PCB made to s

PCB's for oven profile testing

Electronics Forum | Wed Aug 28 18:08:07 EDT 2002 | MikeF

This looks like it may be a good application for an Air-Vac or Wenesco type solder station. It is a solder pot that has a small motor to pump solder up through a chimney. You can put different nozzles on the top of the chimney, so you only apply sold


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