Electronics Forum | Fri Sep 25 20:11:58 EDT 2015 | ercdave1
Thank you for taking the time to read this post. I hope I can get some help since I am at the point where I don't know what to do. I have a Q block Universal GSM2 having some issues. I am getting an error message that reads. "spindles Not seen for
Electronics Forum | Wed Mar 08 19:29:55 EST 2000 | Charles Leech
This is just an Alert: We had a lesson on the effect of air shipments of devices which have been fully saturated with moisture. After being in a pressure cooker for two hours in Singapore, devices were sealed in metalized vapor barrier bags. They we
Electronics Forum | Tue Feb 29 10:14:02 EST 2000 | Robert Hartmann
My company is just getting into the flip chip packaging arena. We are putting in a prototype/small volume wire bond PBGA line. We have some questions with regard to choosing solder balls and cleaning of flux. 1) Is there a formula for the shrink
Electronics Forum | Tue Feb 29 21:53:46 EST 2000 | Kelvin Chow
Dear Robert, On PBGA assembly, BGA sphere shrinkage number depends to the following factors, a. BGA Sphere size (before reflow) b. Solder mask opening diameter As far as I know, no formular has been established yet. Most of my friends just collect
Electronics Forum | Mon Feb 28 03:46:34 EST 2000 | Hany
Hello 1-In our facility we face a lot of power failures due to the to the city electricity network problems.So, it has hppend many times to loose some PCA's inside the reflow oven. Of course it costs a big money to buy a UPS for a reflow oven. One
Electronics Forum | Sat Feb 19 05:07:28 EST 2000 | Dean
I'm not exactly sure of your problem...but I'll give it a shot. I assume the screw is on the solder side of the board. If you wave solder the screw the head will fill in with solder. Try a water solouble mask or peelable laytex mask over the screw
Electronics Forum | Sun Feb 13 01:35:55 EST 2000 | Dean
Without further information my first guess would be lack of flux to "cut through" the ENTEK layer. Question: In X-ray is the suspect ball of equal diameter when compared to adjacent balls? If no then the volume of solder is different which would po
Electronics Forum | Mon Feb 14 20:55:19 EST 2000 | Thomas Ravener
You need to decide what types of processes you need to run right now. What is the mix of different devices and what volume is required for each product. Are you doing a mixed technology board (SMT & PTH) or just SMT. Are there fine pitch devices (und
Electronics Forum | Mon Jan 15 15:33:41 EST 2001 | davef
First, we have never repackage devices, as you propose. Our schedule has us standing at Receiving like panting dogs waiting for the material required to jump the job, much less giving up the time and money to have parts repackaged. Second, fabricat
Electronics Forum | Sat Jan 06 21:56:54 EST 2001 | Greenman
While solder paste height is one possible process indicator, the other guys are right on the money - volume is key. One way to study overall paste volume is to measure every single pad, using a 3D laser analysis (see you next week for board 2)... OR
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