Electronics Forum | Thu Oct 17 21:32:28 EDT 2002 | davef
Please help to clairify the problem. Are we talking: * A pre-reflow [placement] problem? * A post-reflow [solder wetting] problem? Is the wetting issue that you mention related to the board or to the component? Please give us a little more detail
Electronics Forum | Sat Dec 17 07:19:37 EST 2005 | aj
All, I am currently finishing off my PO for solder bars,paste,solder wire and Flux for the changeover to leadfree. Surely the company is not expected to take the full hit on this cost alone? I know there is some funding available for this but as f
Electronics Forum | Mon Apr 09 05:15:36 EDT 2001 | sinclair
Why measure solder volume? I believe if one understand the process well enough, the effort should be spent on area that will gives better indication of your solder printing process. From my personal experience, a lot of auditor knows little of the pr
Electronics Forum | Sun Mar 31 22:50:28 EST 2002 | ianchan
Nope, we do not have solder beads, like we said, what we have are near perfect solder fillets except for the portion where the component is "floating OFF" the pcb pads. We are now mucking through the IPC-A-610C for specifications dictation on "tilted
Electronics Forum | Thu Nov 08 06:12:03 EST 2007 | mattkehoe
Can someone point us in the right direction? We are trying to find a formula to determine the "cubic mils" of solder we end up with after reflow. (No components during the reflow) Some of the discussions we've had about it produced the thoughts bel
Electronics Forum | Tue Sep 14 02:46:17 EDT 2010 | grahamcooper22
Hi Gani, Looking at the pictures in the report it looks as if there is a thin coating of solder on the pcb pad....but it looks like the BGA sphere was barely in contact with the pad. This could be caused by insufficient solder paste on this pad...may
Electronics Forum | Tue Sep 04 09:38:38 EDT 2012 | cobham1
The best thing you can do is to clean the board that has a solder paste defect on it. If you don't you probably will have issues after reflow. This could include bridging, raised parts, or any number of issues. You need to remember that if you are re
Electronics Forum | Mon Sep 17 03:59:52 EDT 2012 | stivais
Hi guys, We have an interesting case we haven't seen before (see the picture below) http://postimage.org/image/lu2f4ae55/ Solder balls form on unpopulated pads after reflow. 1. Reflow profile is fine. 2. Stencil thickness / paste volume is also f
Electronics Forum | Mon Apr 19 02:49:56 EDT 1999 | Raul N.
25 PPM)! 1. Is there a better process to solder the leads of QFP's with lifted "minute" lifted leads still having a realiable solder joints? 2. Or has anybody tried modifying solder pads and use thicker solder paste deposit to compensate for the ga
Electronics Forum | Tue Jun 04 17:05:52 EDT 2002 | davef
Solder balls floating around on the air currents of a reflow oven. I sincerely doubt it. Could the solder on your gold fingers be from: * Excess placement force during P&P? * Ejactula from solder deposits during rapid preheat ramp rates? * Ejactula
