Electronics Forum | Fri Jul 06 12:39:01 EDT 2007 | blnorman
What's the metallization on the board? We use an immersion tin board and had to increase our profile to successfully solder.
Electronics Forum | Wed Jul 11 10:08:44 EDT 2007 | pauld
There are a lot of older threads on this topic. Any new alternatives to using temperature probes for characterizing reflow profiles? The mfg just DOUBLED the price on the probes to $989 each! I prefer using the probes for surface temp and the majorit
Electronics Forum | Mon Jul 16 10:28:08 EDT 2007 | wana
Thanks guys for the suggestions. But, what I am looking for is data, papers, articles to support this process of using lead free parts in leaded process. Again thanks for any help that you can provide.
Electronics Forum | Mon Jul 16 11:04:21 EDT 2007 | davef
You want published articles? Look here: http://www.google.com/search?sourceid=navclient&ie=UTF-8&rls=GGLC,GGLC:1969-53,GGLC:en&q=leadfree+in+snpb
Electronics Forum | Mon Jul 16 16:42:40 EDT 2007 | pnguyvu
Hi Jacky, It seems you have solder bead problem, beading occurs when the solder paste brick splatter as a component is placed into it, after reflow, the splatter becomes a spherical solder ball. Hope this will help. Steve USA STENCILS
Electronics Forum | Wed Jul 18 11:33:01 EDT 2007 | davef
Look here: * http://www.tpub.com/neets/book7/24k.htm * http://www.engplanet.com/redirect.html?3809 Search the fine SMTnet Archives for other links to component identification sites
Electronics Forum | Tue Jul 17 10:11:59 EDT 2007 | hussman
Component cost or placement cost? Hand placed or machine placed? If all machine placed, how big of a board? Panelized or not? Any thru-hole? Any shields?
Electronics Forum | Wed Aug 01 12:23:21 EDT 2007 | stepheniii
Don't forget rework, post production eco's and other mods. Also if it's on a generic base, how do you spot slight misplacments? Board shops have some fallout, now the fallout with be with the assembly makers and with components trapped on the subst
Electronics Forum | Thu Aug 02 18:42:02 EDT 2007 | grantp
Hi, The thing is I don't see, even if this was a viable process, how it would be better. It's still multiple layers of copper with components on one side of it. It's the same as what we do now, but just much more complex to build? Grant
Electronics Forum | Thu Aug 02 08:05:59 EDT 2007 | realchunks
Hi John, If you are wicking very high o components, try speeding up your conveyor speed slightly. A few inches per minute will not change your profile much and may get rid of this problem.
