Electronics Forum | Mon Sep 10 12:51:25 EDT 2001 | Carol Stirling
That's my Typo... couldn't figure out how to fix it. It should read SMT -boards with lots of SMT parts, including PBGA. I'll be more specific next time.... Thanks for the replies.. Carol
Electronics Forum | Mon Sep 10 13:54:29 EDT 2001 | zbosskc@netscape.net
We currently use 120 psi top pressure and 110 psi bottom pressure using a Westek Triton DI wash and have had no cleanliness issues with any of our vendors and with surface analysis.
Electronics Forum | Sat Sep 08 21:40:10 EDT 2001 | fastek
I'm taking over a company that uses Topaz X's. Anyone have opinions, good or bad that they would care to share? It's a high mix, low-mid volume facility. Thanks...Rick
Electronics Forum | Wed Sep 12 20:46:10 EDT 2001 | davef
Dunno, but if I had to guess, your DI is corroding the stainless. But then again, some saponifier concentrations can be overly caustic
Electronics Forum | Wed Sep 19 10:19:28 EDT 2001 | davidd
Hi Jake, in your experience, what to do feel is the level of automated 3D paste height or volumetric inspection required moving to the 0201 process control requirements and defect detection. Dave
Electronics Forum | Mon Sep 17 10:09:45 EDT 2001 | martys
What variables that you have tested are sensitive to producing tombstoning defects and what advice can you provide to minimize them?
Electronics Forum | Mon Sep 17 10:11:26 EDT 2001 | jstarkweather
What is the tightest spacing that you have assembled 0201 components? Under what assembly scenarios did you produce the best/worst yield at this spacing?
Electronics Forum | Mon Sep 17 10:29:01 EDT 2001 | ksfacinelli
Please describe what was found to be optimal print parameters. I am also interested in hearing about stencil and design layout considerations. Thanks, Kevin
Electronics Forum | Sat Oct 06 08:44:22 EDT 2001 | davef
�Control System Design And Simulation� Jack Golten, Andy Verwer; McGraw Hill College Div; 1991; Paperback; 388 pages; ISBN: 0077074122 [Amazon.com lists two of �em for $20 used.]
Electronics Forum | Fri Sep 21 01:31:13 EDT 2001 | Stoney Tsai
Guys, If there are any specifications or ciriterions for solder paste deposition thickness and volume evaluation. For example, QFP (0.5 mm pitch), 6~8 mils, 3000 mil^3 PLCC: 8~10 mils, ... . . Thanks in advance. Best Regards,
