Electronics Forum | Fri Aug 06 04:54:19 EDT 1999 | Scott Bradley
| I am trying to program/run a test board on a CS-400C machine for the very first time and am having problems making it run right. | | I am programming and downloading this directly out of CircuitCAM software. | | After setting the origin on the CS
Electronics Forum | Fri Aug 06 12:07:46 EDT 1999 | Robert Horowitz
Peter, Try calling Contact Systems for your answer. We can be reached at (203) 743-3837. Ask for the Field Service Dept. They can easily assist you. Regards, Robert Horowitz Sales Manager Contact Systems | I am trying to program/run a test boa
Electronics Forum | Fri Jul 30 20:11:35 EDT 1999 | Mike Konrad
It is true that the use of saponifiers (and other water soluble additives) will lower the surface tension and aid in under component penetration. It is also true, however, that other specific design features within a batch machine can also aid in un
Electronics Forum | Tue Jul 20 17:47:28 EDT 1999 | Deon Nungaray
| I recently switched from solder paste in 500 gram jars to 500 gram tubes. I did this to try to limit the time the paste is exposed to the room environment. But we have a need to clean the stencil every 4 - 5 boards which means taking the bulk paste
Electronics Forum | Thu Jul 15 08:03:36 EDT 1999 | Mark Quealy
| | I am trying to solder a 388 ball BGA to an Andon Electronics Corp. BGA socket adapter and I am having problems in the reflow of this part. I put no clean paste flux in the solder cups of the adapter then put the BGA part onto the adapter and run
Electronics Forum | Mon Apr 12 22:13:15 EDT 1999 | Dave F
| Hey guys, | We are opening our new shop in a hotel and would like to hear your inputs. We will be providing contract manufacturing as well as equipment sales from this location. It will be mostly for the surface mount side of our business
Electronics Forum | Fri Mar 19 11:01:42 EST 1999 | Dave F
| Hi folks, | | I am looking for inputs on a long-standing problem encountered in our shop: Bottom-side parts (passives) falling off in the Wave...where the only remnants of the part is a flattened glue dot of proper diameter and volume, and somet
Electronics Forum | Thu Feb 04 18:45:56 EST 1999 | Earl Moon
| Actually, solder paste adds about 12% to the joint volume for PBGAs, or about 31% for MicroBGAs -- assuming standard (recommended) pad sizes and stencil thicknesses, and paste with 90% metal content (50% metal by volume). Michael, In the "real wo
Electronics Forum | Wed Jan 27 23:29:28 EST 1999 | parag palshikar
| | i am working with the noclean process and getting white residues on the bottomside of the board probably due to the | | wave soldering flux.i am using a no-clean solder paste and a noclean wave solder flux.The boards passed the accelerated tempe
Electronics Forum | Wed Jan 20 21:25:32 EST 1999 | Tony A
| I get white residue on my PCBs after vapor degreasing. No comments on the vapor degreaser. Yes, I still use one of these. I use a vapor degreaser and a 1,1,1 replacement solvent due to the quick clean and quick dry times. Anyway, I only get whi
