Electronics Forum | Fri Oct 05 07:46:24 EDT 2001 | george
Specifications of testing force are not fixed, but (incase of wave soldering) the value should be at least 120-150 % of the force the wave. So for small chip components we assume that the force from the wave on the component is about 3 Newton, this m
Electronics Forum | Thu Sep 06 10:55:37 EDT 2001 | davef
saturation occurs at ppm levels. Remember, IPA is extremely flammable and its bulk use makes the plant liable to all sorts of quite repressive safety rules/regulations and so on. Ignoring these rules exposes the owner to fines and possible plant cl
Electronics Forum | Tue Sep 18 12:05:08 EDT 2001 | jschake
Optimal Print Parameters: I have responded to a similar question in the thread titled �Stencil Printing For 0201 Applications�, posted by markt and will refer you to that for addressing this question. If you seek clarification on any of those point
Electronics Forum | Tue Sep 18 13:09:21 EDT 2001 | jschake
Hey, where's the 0201s? Just kidding. Off the top of my head, I do not recall seeing results of such a test. Nonetheless, I�ll consult with my peers and let you know if we come up with something that could assist you. That said, with a few more d
Electronics Forum | Tue Sep 18 16:48:55 EDT 2001 | jschake
Why do you think that assembling the BGA, QFP, and fine pitch parts will solve your bridging problem? I would think doing this may cause you more grief by having these more massive components being reflowed upside down fall off during the second pas
Electronics Forum | Wed Sep 19 09:34:08 EDT 2001 | jschake
Both FormFlex and Grid-lok tooling systems are marketed as compliant tooling systems. Both are able to conform to the variations of the topography on the bottomside of a substrate to provide full support during printing of 2nd side assembly. The ba
Electronics Forum | Sat Oct 20 00:34:57 EDT 2001 | kenbliss
Hi mike The solution is simple but two fold, first your process needs to be changed a bit, you need additional feeders to pre-stage the new P/N run and prestage the extra feeders for reload as certain higher volume components exhaust. The idea is t
Electronics Forum | Tue Oct 16 06:08:12 EDT 2001 | wbu
Hi Dave, tweaking, oh yes, we did like it to have that job done and not have people sitting around waiting for work or beeing able to deliver on schedule. Nonconformity report, ...ummmmh, weren�t that big that we thought we needed it, actually the t
Electronics Forum | Wed Oct 17 09:38:55 EDT 2001 | fmonette
Dear Daniel, I assume that these components are moisture-sensitive. If they have absorbed too much moisture prior to reflow you might be experiencing popcorning. This typically shows up as a bulge over the surface of the die, in the center of the p
Electronics Forum | Wed Oct 24 18:10:56 EDT 2001 | davef
We attended several presentations on AOI machines at a recent SMTA meeting. The presenters gave a section about process verification. They bantied about numbers. [I want to say 350 DPMO, but we glaze over when it gets to that stuff] So, you might
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