Electronics Forum | Fri Nov 21 16:48:05 EST 2008 | kennyg
Anyone have an 'easy' solution for reducing PCBA handling damage. I'm fighting low level chipped, scuffed and broken-off SMT parts. The damage is spread out across different areas of the assemblies. The assemblies are double sided SMT with 0402's
Electronics Forum | Tue Dec 09 18:03:39 EST 2008 | davef
First, you cannot determine foil thickness from its weight per area, because there is significant variation in the density of electrodeposited copper. Second, the official IPC specification for minimum thickness is "after" processing by the fabricat
Electronics Forum | Wed Dec 24 11:23:22 EST 2008 | childs
I can't seem to locate any information/concerns about moisture entrapment in IC packages on the promary side in a double sided SMT assembly using water soluable solder paste when soldering the second side. A typical process would assemble/reflow/cle
Electronics Forum | Fri Jan 16 16:36:37 EST 2009 | rwyman
We've used our standard chipbonder- Heraeus PD944- for this type of application. While it does cure before reflow, when the part is placed onto the site, the material compresses and spreads and thus that potential standoff isn't an issue. We've als
Electronics Forum | Mon Jan 19 08:37:16 EST 2009 | lkpdsund
Hello all! We possess a speedline electrovert omniflo 7 reflow oven at my site. Last week we examined how the solder profile was affected by fan-speed and by providing the soldering process with compressed air(O2) or nitrogen(N2). We also ran the sa
Electronics Forum | Sun Jan 25 17:40:16 EST 2009 | cuperpeter
Hello All, I have a problem with nonwetting Au finish after second cycle of reflow soldering doublesided boards. Solder nonwetted pcb pads (is wicked to component terminations) Either these pads or some of non component pads became discoloured from
Electronics Forum | Wed Feb 04 09:58:50 EST 2009 | dyoungquist
As was stated before, you need to have oven temperatures (profile) set such that you get good solder joints with the paste you are using. And definately run a profiler through yor oven to verify it is working properly. As for components, most data
Electronics Forum | Tue Feb 10 21:12:08 EST 2009 | smartasp
Dear ALL Thanks for the valuable input so far. The solder results is the first priority whereby the solder paste requirements sets the guidelines for the profile first. We use Kick profiler with the latest software. We verify the oven temp and dist
Electronics Forum | Wed Feb 04 10:24:05 EST 2009 | dyoungquist
We use SN100C in our selective solder process. The 3 keys to proper hole fill are applying a proper amount of flux, heating of the pcb and solder temperature. If either the pcb or solder is not hot enough, you may not get good hole fill. To adjus
Electronics Forum | Thu Apr 23 07:51:45 EDT 2009 | scottp
Every paper I've seen published shows that BGA voids either have no effect or actually give a slight improvement. The one exception are voids with a root cause in bad incoming boards, such as champagne voiding where nearly the entire interface is go
