Electronics Forum | Fri Mar 30 23:35:43 EDT 2007 | mika
Question: Does this formula apply even for the small LGA:s like LGA36 6.5 x 3.5 x 0.6 mm pad size 0.35mm pitch 0.60mm? We use a 0.13 mm stencil thichess beacuse on the same board there is some P.I.P comps. The board dimensions is 35 x 50 mm on a pane
Electronics Forum | Mon Apr 02 01:24:52 EDT 2007 | Haris
Dear all, I want to know the difference between the CSP and the BGA (I think there is only in the mesh pin difference). Secondly, if their solder balls have same dia, LxBxH are also same with the the manufacturing of the pin coating chemical elemen
Electronics Forum | Fri Apr 06 01:46:59 EDT 2007 | Haris
Basically its spec. gives surety regarding its chemical and physical properties. if he doesnt follow the spec then may be he may find good physical soldering appearance but chemically it may goes down through Electrical or Environmental testing and i
Electronics Forum | Wed Apr 04 04:26:08 EDT 2007 | AR
Pavel, We had exactly the same kind of problem with exactly the same type of component. Our components were well within their best before -date so it is not question of that. As we could not get it to work we changed to nickel barrier finish on the
Electronics Forum | Wed Apr 04 10:48:25 EDT 2007 | pjc
Indium Corp. has some, 3549-HF and 3590-T, both are OK for foaming. Most of the better performing newer fluxes require spray application for best performance. Alpha, Kester and others have wave fluxes too. http://www.indium.com/products/circuitboar
Electronics Forum | Wed Apr 04 13:38:05 EDT 2007 | dsoohoo
My apologies in advance if this is off topic for this forum. I am looking for a recommendation on a source for foreign object debris training for electronics manufacturing. Our current program utilizes videos which mostly pertain to the aerospace ind
Electronics Forum | Thu Apr 05 08:04:40 EDT 2007 | davef
On finding baking recipes in the fine SMTnet Archive, your problem is not in the flex portion. It's in the rigid [FR4] portion. On baking advice from experts look here: http://www.circuitnet.com/experts/EQ10120.shtml Finally, on reworking your ou
Electronics Forum | Tue Apr 10 11:36:46 EDT 2007 | Pro 2000 inc.
Hi there, I recently bought a used Samsung CP30V placement machine witch is about the same machine as a Quad QSA30V. We need to replace some defective nozzles, add some feeders and find spare parts. Where should I look for to get all of these. We tr
Electronics Forum | Thu Apr 12 08:48:35 EDT 2007 | stepheniii
It depends on the contract. Is it they build what they are told to build or they are saying they are building leadfree. And it's not the assembly or the part that has to be leadfree. It's the parts of the parts that have to be less than the given p
Electronics Forum | Thu Apr 12 01:11:12 EDT 2007 | Haris
Gull wing components are name on the pin/lead shape of the ICs like sop, qfp, pqf etc while plcc IC package is named on J-lead componets. Flat ribbon is of cable/wiring type and it is not a component,see this website. http://directory.jimtrade.com/2
