Electronics Forum | Mon Aug 28 12:41:35 EDT 2000 | JAX
MoonMan, I'll take a crack at the list. Feel free to answer the ones I don't! 1. Solderability is a parameter which indicates how well a component can be soldered. As far as Solder Termination Coatings go, here are some up�s and down�s of a few. Ha
Electronics Forum | Mon Feb 22 13:39:22 EST 1999 | Justin Medernach
| Can anybody give me the Pros and Cons of of using Cartridges over jars and/or vice-versa. Also, if using cartridges, what is the best way to keep the paste from seperating, short of buying a mixer that cost over $5000.00 | Thanks, | Bill | Bill,
Electronics Forum | Thu Aug 24 00:05:14 EDT 2017 | heros_electronics
The first reply from Tsvetan Usunov already > answered your question - there are no thermals > for one side of the chips. > > You can try to > reduce the phenomenon by using different solder > pastes, tuning your soldering profile or even > swi
Electronics Forum | Thu Oct 04 00:07:29 EDT 2018 | gaintstar
flason smt SMT spare parts: http://www.flason-smt.com/product/SMT-spare-parts-Assembleon-Controller-Bvm-5322-216-04698.html http://www.flason-smt.com/product/SMT-spare-parts-Assembleon-Control-V2-1-Rev-B-8mm-4022-594-10010.html http://www.flason-smt
Electronics Forum | Wed Apr 26 22:34:49 EDT 2000 | Eric Chua
1. Verify all the part had load to machine. Get ready for the profile. 2. Run the board with double side tape. Is better to run one board for each machine. 3. Verify all the placement ( missing, misalgnment,etc )and check the value using meter for a
Electronics Forum | Wed Aug 23 15:19:11 EDT 2000 | Dr. Ning-Cheng Lee
From solder material point of view, a solder paste with slow coalescence rate, or slow wetting rate, will be most desirable. Processwise, allowing the paste to stay at soaking zone for longer time will dry out the volatiles, and reduce the chance of
Electronics Forum | Mon Jun 25 20:50:33 EDT 2001 | davef
If your solder paste has forsaken the pads and gone to all the work of climbing the leads, it�s because the leads are much warmer than the pads. Some like it hot!!! We talked about this on SMTnet within the past 6 months. Please check the archives
Electronics Forum | Tue May 25 10:16:03 EDT 2004 | Bimal Patel
We are doing assemblies using Immersion Silver coating for RF assembly for a while now. We did not have problem using 63/37 SN/PB solder paste untill recently. We started seeing black marks on the finish and around the solder joint recently. We have
Electronics Forum | Tue May 25 10:16:07 EDT 2004 | Bimal Patel
We are doing assemblies using Immersion Silver coating for RF assembly for a while now. We did not have problem using 63/37 SN/PB solder paste untill recently. We started seeing black marks on the finish and around the solder joint recently. We have
Electronics Forum | Fri Sep 30 19:14:35 EDT 2005 | DasonC
The stencil is 5 mil thick and the aperture is 12 mil sq. We found open but can't detect by x-ray. The process which we are using is no clean TIN/LEAD. Just thinking the ball size variance from 0.35~0.45mm per IPC-7095, in worst case scenarios, th
