Electronics Forum | Tue Oct 05 13:30:23 EDT 1999 | Debbie Alavezos
| Hi, | | Help! Could anyone help to enlighten me on this? | | Question: | | If I have a CSP/BGA package of size X by Y and the standoff gap between the component and PCB is Z, What is the maximum allowable Y/Z or X/Z that using a normal water cl
Electronics Forum | Mon Jul 26 18:28:10 EDT 1999 | Jon Prokop
Can anyone give me the virtues of SMT package castellations vs. no castellations with particular reference to the ruggedness and reliability of the solder joints? Any references or studies that you can point me to? Also, although I'm in favor of pr
Electronics Forum | Thu Feb 18 17:15:24 EST 1999 | Jason Gregory
Check this company out....Winslow Automation. They have a real easy "preform" for reworking BGA's. You just wick the old solder off, flux the packages, attach an appropriate preform, reflow it with a corresponding profile, remove the water-soluble pa
Electronics Forum | Mon Jan 25 18:15:39 EST 1999 | Joe
Greetings, We are discussing what should and what should not be baked and vacuum packed. Should we just concentrate on the fine pitch packages and the bga's? What about those components which come on blister tape, should they get baked and re-packed
Electronics Forum | Tue Dec 29 08:11:18 EST 1998 | Kelvin Chow
As CSP and BGA packages become more and more popular, I want to know if anyone get problem to assembly CSP packages. Currently, most CSP use 20mil solder ball diameter and it is a trend to go down to 16mil or even 12mil. I wonder if there is a probl
Electronics Forum | Mon Dec 28 10:17:09 EST 1998 | Earl Moon
| Does anyone have any experience with vibration testing of BGA packages and assemblies? We are starting to design BGA's into some of our products and we have not found very much information on vibrational test results. Any information will be help
Electronics Forum | Mon Dec 28 11:21:21 EST 1998 | Brad Kendall
| Does anyone have any experience with vibration testing of BGA packages and assemblies? We are starting to design BGA's into some of our products and we have not found very much information on vibrational test results. Any information will be help
Electronics Forum | Fri Oct 02 16:04:47 EDT 1998 | Benji Acosta
Hi Dave, Thanks for your response. HAST is an acronym for Highly Accelerated Stress Testing. Instead of the conventional PCT or Autoclave which requires say 168 hours, HAST can tremendously shorten the time. There has been correlation being estab
Electronics Forum | Thu Sep 10 11:57:20 EDT 1998 | James Michaud
I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress reli
Electronics Forum | Fri Sep 11 00:52:19 EDT 1998 | Rick Thompson
| I'm very familiar with the great board space savings of BGA and all the "claims to fame." However, can someone out there tell me if any concern exist in the inspection realm. Additionally, solder cracking, CTE/TCE mismatches, no leads for stress re
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