Electronics Forum | Wed May 29 15:44:59 EDT 2002 | Jacob Lacourse
Hi, All Our board design requires us to selectively plate some connector pads with gold. The problem is we have changed board houses and they charge a heafty amount to mask the rest of the board. One option is to allow them to plate the whole bo
Electronics Forum | Fri Jan 02 14:04:56 EST 2004 | jjwhite
Has anyone had any experience with 60/40 Sn/Ni(300 u in.) over Ni(300 u in.)? If so, what kind of solder issues might exist with 63/37 Sn/Pb reflow? Is a different paste needed? Also, what is the benefit of using the same platings with a top plating
Electronics Forum | Tue Oct 26 12:18:53 EDT 1999 | Gary Kemp
We are having a discolorization problem with the gold fingers on our PCB's. I have been made aware that there is a gold touch-up paint (masking) that is available. Would anyone know where I can get my hands on some of it? Any help would be appreci
Electronics Forum | Thu Dec 08 08:29:25 EST 2005 | davef
Grant The solution to soldering problems with immersion gold boards is: find a supplier that can control his/her process. Electroplated gold over nickel is a very reasonable process. Billions of wire bound boards use it evry year.
Electronics Forum | Fri Nov 03 17:36:37 EST 2000 | Thomas Ballhausen
Thank you for your hint. According to the substrate supplier the thickness is less than 1 micron. After Ni/Co layer there is water rinse, then "gold strike", another rinse then "gold plating". But still the total Au layer shall be less than 1 micron
Electronics Forum | Thu Sep 16 17:22:16 EDT 1999 | DaveJ
We have some SMT components with gold plated leads. They're actually LCC led packages. A good solder alloy to use would be Indium / Lead to reduce tin dissolution into the gold and avoid the resultant brittle intermetallic compound. However, a recomm
Electronics Forum | Mon Dec 28 12:16:40 EST 1998 | Jon Medernach
Chris, We are involved in several developments using gold stud bump attach. We make a stud bump bonder and have several processes for attach. Solder attach is best done by plating up the substrate, the underfill must be able to provide enough mechan
Electronics Forum | Tue Dec 29 10:24:35 EST 1998 | Earl Moon
| Chris, We are involved in several developments using gold stud bump attach. We make a stud bump bonder and have several processes for attach. Solder attach is best done by plating up the substrate, the underfill must be able to provide enough mech
Electronics Forum | Thu Aug 06 12:58:35 EDT 1998 | Paul J. Lingane
Is there any problem using SMT on gold boards? 15 years ago we were told not to use gold boards, but I can't remember why. Judging by the other postings it now appears to be common. Only problem I see is that the nickel should be plated, not elect
Electronics Forum | Mon May 24 15:45:58 EDT 2004 | mleber
I am interested in how Military / Class 3 manufacturers are handling Gold SMT components. We are receiving an increasing number of tape and reel components that are gold plated. Per J-STD we need to tin all gold components. Are parts being removed fr
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