Electronics Forum: reflow and profil (Page 46 of 305)

Ceramic case resonators falling to pieces after reflow soldering.

Electronics Forum | Wed Aug 30 00:16:15 EDT 2000 | Craig

We are reflowing ceramic resonators and are finding their tops falling/popping off when handling the pcbs during final assy. The epoxy seems to be coming off the components base and adherring to the lid. The components are "RFM resonators", case type

What is the rootcause for BGA Lifted PAD after reflow

Electronics Forum | Tue May 20 09:34:28 EDT 2008 | roc2x

Well something is different isn't it? * Paste * > Part supplier * Board fabrication * Was the > profile that you reference the measured > temperature or the the settings keyed into the > oven? > > The cross sections seem to show less > than exp

Re: Convection Oven and thermo profiling of Circuit Boards

Electronics Forum | Tue Apr 18 19:37:35 EDT 2000 | Russ Cutler

Let me be more specific about my dilema. We have used a vapor phase reflow process for many years. We just bought a Heller 1800 this year (2000). We may very well be able to run all 600 very different board types we build in 10 recipies on the Hel

Profiling - suspect flux burn out before reflow trouble shooting

Electronics Forum | Fri Jul 04 00:36:25 EDT 2008 | shrek

Try a linear, very flat ramp rate on the order of 0.5 degrees celcius per second. I know this is hard to accomplish with a five zone, but try to lower the first couple of zones (the preheat zone), and then spike to reflow aggressively during your la

Profiling - suspect flux burn out before reflow trouble shooting

Electronics Forum | Thu Jul 10 10:25:05 EDT 2008 | gregoryyork

I guess the paste is Leaded hence the 220 Peak temp and the Sn100c is Eutectic at 227C so you need to be hotter to melt the HASL finish or you are relying on it alloying together with the paste which takes much longer. suggest running peak temp of 23

Re: Double-sided reflow with BGA??? Can it be done?

Electronics Forum | Fri Sep 11 07:29:03 EDT 1998 | Wayne Bracy

| I was wanting to know if double sided reflow can be done with a metal plated BGA on topside. We would be running bottom side first. My boss seems to think the only way it can be done is by placing glue dots on the bottomside compoents because the

Profiling - suspect flux burn out before reflow trouble shooting

Electronics Forum | Thu Jul 03 19:27:54 EDT 2008 | proy

5 Zone HVA70 Oven Board 6 layer, 10" x 13" lots of space, most critical is 100 pin QFP AIM Water Soluble 487 Tin Lead paste on SN100C HASL boards This board is giving me disproportionate grief! I am running 23 in / min which gives me about 3.1 mi

SPC and Wave

Electronics Forum | Thu Jul 14 10:38:20 EDT 2005 | slthomas

How about profiling?

small and good pick and place machine

Electronics Forum | Thu Sep 05 23:18:03 EDT 2013 | feiyangniao

There is a new toy I received today: a NeoDen TM-240A automatic desktop pick and place machine! I’ve kept my eyes on this baby for a quite a while, and finally decided to make a purchase last week. The shipping was very fast: DHL from China, a total

Looking for trays to lay boards on in reflow oven

Electronics Forum | Tue Jun 11 11:25:57 EDT 2019 | don_julio

> If the board is just not reaching the temps you > need, you could place them in an oven to > "preheat" them. When I was building a > rather thick board with a copper core I had to do > this. Since we were only doing sma


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