Electronics Forum | Mon Oct 31 20:35:58 EST 2005 | milroyperera
If I brief shifting, I checked the component before it enter the reflow oven and saw that the IC is perfectly aligned on the pads but when it comes out from the oven the IC is floated on the pads. The floating is irregular and the IC is shifted away
Electronics Forum | Fri Dec 16 19:48:16 EST 2005 | Ola
Mika has a point here. AMD has some RoHS compliant components that are Not backwards compatible, in terms of leaded soldering paste & reflow temperature! They are Not willing to tell You Why! I think it has to do with something like: http://www.webel
Electronics Forum | Wed Feb 01 17:36:37 EST 2006 | Cal Kolokoy
Your method of only using solder paste to form the solder joint w/out collapsing the ball is very unconventional, just as others have mentioned on this thread. I bet you those joints will fail under thermal and mechanical stress. Have you done due
Electronics Forum | Mon Aug 14 12:08:35 EDT 2006 | cuculi54986@yahoo.com
I agree with using the homeplate design on chips. Some Pb-free solder paste manufacturers recommend 1:1 apertures. This, in my experience, is not a good idea with any of the SAC305 pastes I've tried. I've been using the same stencil design guideli
Electronics Forum | Thu Sep 07 10:45:46 EDT 2006 | vicknesh28
Yes solder is reflowing on the pad but doesnt wick up the lead. Solder paste is sufficient. It just forms a saddle like appearance beneath the failing lead. The failed lead doesnt get reflowed at all. What puzzles me is how can hundreds of leads wet
Electronics Forum | Tue Oct 16 08:09:39 EDT 2007 | davef
In the fine SMTnet Archives, grantp gave the following response to a similar question: KIC supplies a free-downloadable software that "takes your profile data and recommends the best oven temperature settings and conveyer speed for your oven. The so
Electronics Forum | Mon Aug 24 10:35:54 EDT 2009 | rossi
I don't think its an issue with the PCB. When we just put the paste down and not the BGA the solder paste seems to adhere to the PCB pads very well (not brittle). Also we have other very similar PCBs that we run different normal silver content BGAs
Electronics Forum | Thu Mar 16 19:12:22 EDT 2017 | pzappella
Hi Rob, Thanks for the LED paper. I like the void area equations but I am puzzled, the paper did not say if the solder was a solder paste that would generate a lot of voids, or a fluxless preform or sinter material. The measured voiding level
Electronics Forum | Wed Apr 11 20:58:12 EDT 2018 | jacobidiego
YES to the first question in some points of the board. Bulky, to the second question when it is not in short. What you say about the PAD height, helped me to understand why the SPI shows weird values for other measurements. I am currently doing test
Electronics Forum | Thu Feb 02 09:06:53 EST 2006 | drewake
Sorry, I am jumping into this late - I'm a new user. Our company is looking to perform an evaluation for a new paste. We are looking at a 63/37 no clean - type 3 or 4. Our technology is currently at 0201s, .4mm pitch ICs & .5mm uBGAs. I have
