Electronics Forum: timely (Page 455 of 1078)

Batch Ovens

Electronics Forum | Fri Nov 04 17:40:58 EST 2005 | JeffP

did not count from the time the board was > introduced, because the oven did that. What we > had to count was the seconds from the reflow > point, because it would vary from board to board > as the oven heated up. > I am not certain exactly how

Batch Ovens

Electronics Forum | Tue Nov 08 22:17:57 EST 2005 | grantp

Hi, I would be interested in the data, and I after our experience with batch convection I am quite skeptical. I would be very interested in temperature plots. What I would like to see before I ever considered a batch convection oven is how the oven

Samsung SM320 VS Assembleon 8 head Opal XII

Electronics Forum | Sat Dec 17 15:46:28 EST 2005 | Csabee

Samsung SM320 don't have sensor for recognizing component. Only using Fly&Fix camera. In first time the korean samsung service engineer advised me (3,7light settings for chips and the machine generated many dumps, sometimes 50 or more per day. But n

Immersion white tin wave soldering problem

Electronics Forum | Fri Dec 16 08:00:26 EST 2005 | jax

What you are most likely dealing with: Insufficient Pure Sn layer ( multiple causes ) Because elevated temperatures accelerate the diffusion process, the thickness of the Pure Sn layer will reduce during every thermal cycle... ( bakeing PCBs, S

profile ramp starts in??

Electronics Forum | Mon Feb 20 20:57:35 EST 2006 | Cal Kolokoy

The ramp sets the stage for flux activation, and if ramping in a linear fashion, burning off some of the volatiles, but yet preserving the activators. The ramp is also intended to preheat the SMDs to prevent thermal shock. Most solder paste data sh

Flux Residues In Lead Free Wave Soldering Process

Electronics Forum | Tue Mar 28 11:17:19 EST 2006 | smartasp

Thanks for the input Guys Yeah the not so knowledgable customer does not like to residues for cosmetic resons. The flux is for lead free process, of the no clean and water soluable type. We have explained to him that technically the residues do not

CP4 of death

Electronics Forum | Thu Apr 13 10:05:47 EDT 2006 | daxman

Okay fellas...I posted awhile back regarding CP4 and CP6 placement issues. I think we may have figured it out. XO/YO and mark read positions were not correct. However, we have a new problem with the CP4-2. I was running the Fuji board, placing a s

AOI for defect detection at soldering process

Electronics Forum | Fri Apr 21 18:43:23 EDT 2006 | SD

Sorry, I have not read the article. However, I do have five years experience constantly tweaking an AOI system that ran ONE product! The strength of the machine was solder inspection. The biggest problem was component color variation and shadowing

Reflow profiling Units

Electronics Forum | Wed Sep 13 10:31:14 EDT 2006 | CL

Hello Brad, We are running the Slim Kic 2000. We have found the predictions to be fairly accurate as long as the suggested change is within 20 degrees of the original recipie. As a test I ran a board with the wrong profile. The predictions got me wi

Industry Standard Acceptable SMT Component loss?

Electronics Forum | Wed Sep 13 12:10:13 EDT 2006 | SWAG

I don't know about industry standards - I suppose it depends on your equipment, really. We are low-volume, high-mix with many, many part numbers. Here's what we do and we have pretty good luck with it: Over-issue parts to kits; 10 over on 1206's,


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