Electronics Forum | Mon Dec 17 11:07:58 EST 2007 | eeltec
I start programing 2 Assembleon 10 years' old Comet machines that my company owns and I will like to know what does each number on the VIOS file means so I can manipulate the VIOS file information directly. Does anyone have information on VIOS files?
Electronics Forum | Wed Dec 19 14:02:18 EST 2007 | gersla
We decided to bake components in tray package at 70 Degree prior soldering. I am looking for suggestion regarding baking time for MSL3 components: Up to 1.4mm package thickness 1.4-2 mm thickness 2-4.5 mm thickness In JEDEC-033B this temperature is n
Electronics Forum | Wed Dec 19 15:12:25 EST 2007 | slthomas
I see. You might request that those parts be provided in the proper trays (125�) for starters, but I do understand the issues with contract assembly. I'd be inclined to write a program to pick them from that tray and place them into a proper one. Wh
Electronics Forum | Thu Dec 20 01:22:41 EST 2007 | gersla
As I told you, some carriers (trays) are limited to 75 degree maximum, and from time to time employees do not pay attention to this. This is one of the reasons. The second reason is that 90 degree still be problematic in a case of rebake more then 3
Electronics Forum | Thu Dec 27 13:37:15 EST 2007 | chef
Mr. Wizard- Bingo, you did it again - don't know why I had to wait for the 3DBB before I saw the light. I have similar sitiaction to Steve - shake and bake, baby - two turns of the rotisserie- now ya got 2 bottles of californy spill on reserve - di
Electronics Forum | Tue Jun 17 15:35:12 EDT 2008 | slthomas
But don't you need to control the rate of the drop in pressure? I'd think if you pull down quickly it just results in the same popcorning you'd see in a reflow oven. I just know it's not hard to boil water in a vacuum chamber. For that matter, it's
Electronics Forum | Wed Jun 18 07:58:23 EDT 2008 | davef
Hi Stu Some seem to believe that vacuum baking will suck moisture from components and boards. Actually, the case is just the opposite. * Without proper definition and control of process parameters, vacuum baking retards the removal of moisture * Eve
Electronics Forum | Wed Jun 18 11:33:21 EDT 2008 | slthomas
Dave, can I assume that in the case(s) you're referring to, there was no gas introduced into the evacuation chamber to push any expelled moisture out of the system? In the industry I was involved with (implantable medical devices), we used nitrogen
Electronics Forum | Thu Dec 20 08:29:52 EST 2007 | cdsullivan
I figured as much. The exacto method is what we've been doing. We did send some back to the fab house and they really "fubar"ed the pads. So we decided to do it ourselves. You are exactly right... it should have been caught before it ever made it to
Electronics Forum | Sat Dec 22 12:36:51 EST 2007 | stimpk
How many do you need? I purchased 800 size 3x1 for our GSM feeders 2 years ago and still have enough to repair for years to come! Its Xmas and I'm in the spirit... send me your mailing address and I'll send you about 50 for free. Kevin Mail back At
