Electronics Forum: reflow (Page 456 of 945)

Old ovens - anyone have one collecting dust?

Electronics Forum | Tue Sep 18 06:19:46 EDT 2012 | jam

we have a 1809 EXL one (reflow oven/lead free approved)

Reflow problem

Electronics Forum | Wed Sep 26 16:42:06 EDT 2012 | ferrog

Per the pictures you sent it may be a Pad Design issue, you need to go to the Part Number Spec and Look for Suggested Pad Layout

Reflow problem

Electronics Forum | Wed Sep 26 18:30:41 EDT 2012 | garym4569

Thanks for the input everyone. We had also suspected pad design, but wanted to get input from other sources. The design engineer has implemented revised pad design in a revision set for production next week. Thanks again, Gary M

Void control

Electronics Forum | Mon Oct 15 09:55:50 EDT 2012 | anvil1021

These microvias were plated shut? Could there have been some out gassing of these plated shut areas during reflow? I agree with your void % assesment unfortunately my Superiors do not... Thank you for the input.....anvil

Void control

Electronics Forum | Mon Oct 15 11:03:49 EDT 2012 | anvil1021

No we havent Xrayed any before reflow, but when we attach the BGAs with just flux they are void free? Thanks....anvil

SMT - PCB combo process

Electronics Forum | Mon Oct 15 08:15:41 EDT 2012 | scottp

Is the designer's concern that the parts will fall off when hanging upside down during reflow? We've been doing this for decades and our test if we think a part is marginal is to glue a 2nd (and sometimes 3rd) part to the back and send it through re

LGA Rework

Electronics Forum | Mon Nov 26 11:33:25 EST 2012 | pbarton

We print paste directly on to the parts then invert, place & reflow using a dedicated I/R rework station. Works well for us on a wide variety of footprints.

Solder Paste layer question

Electronics Forum | Thu Nov 29 14:11:33 EST 2012 | davef

When you say "solder paste layer," what are you talking about: * Post-print / pre-placement quality inspection * Post-reflow solder inspection * er what?

Voids with LGAs

Electronics Forum | Thu Jan 17 20:17:55 EST 2013 | duchoang

We have got lots of voids at ALL LGA. Anyone has ideas to get rid of this issue or just minimize the size of voids ?. With the same paste, same reflow oven, looking good profile, we don't have that problem with BGA. Thanks.

Reflow BGA with A Metal top

Electronics Forum | Mon Jan 28 16:12:47 EST 2013 | emeto

I will treat it as any other BGA. Drill a hole in the board, put thermocouple and do your profile.


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