Electronics Forum | Thu Jul 05 19:37:15 EDT 2007 | davef
We assume the three leads are lined-up perpendicular to the wave. Without taking corrective action, we know this: * 50 thou pitch will bridge * DIP do not bridge As a corrective action that doesn't invovle a respin of the board, decrease the solderm
Electronics Forum | Mon Jul 16 16:02:08 EDT 2007 | ck_the_flip
I have zero experience with SN100c, but hey, how much different can it be from Sn63Pb37?! We solder large connectors all the time - sometimes these connectors reside on a ground plane area. We've been able to overcome hole fill issues (on 63/37) th
Electronics Forum | Tue Nov 27 10:26:22 EST 2007 | ck_the_flip
Alot of that depends on your designs as well. Poor designs with lots of DFM violations WILL require a full-time tech./engineer, whereas with good designs, a conscientious operator (who regularly cleans the nozzles) should be good enough. As Chunks
Electronics Forum | Thu Jan 10 18:32:20 EST 2008 | stevek
Our layout guy recently started making land patterns with the corner lands oversized. These are for leadless and various flatpack parts. He claims this is to improve manufacturing. I had seen a few boards with this just as I got out of the CM worl
Electronics Forum | Mon Nov 10 22:15:53 EST 2008 | fctassembly
Bob The actual process for converting from SAC305 to SN100C is pretty painless. Basic steps: 1) make sure your solder pot is at temp 2) de-dross 3) pull pumps/flow duct(s) and clean 4) purge pot of SAC material 5) remove any remaining dross/alloy i
Electronics Forum | Mon Jan 04 21:03:22 EST 2010 | cman
1) I'm not familiar with the acronym CAF. Could you spell that one out for me? 2)Why do you feel they need to be baked? Are they in a high humidity enviornment? the only time we bake is when we are dealing with moisture sensitive components. Do you b
Electronics Forum | Mon Jul 23 05:40:58 EDT 2012 | franks
We are having a problem with a 601 pin BGA in that the corners of the BGA are lifting and taking the pads with them. Faults are not always seen straight away so we are not sure at which point the fault is happening. So far it looks as though flexing
Electronics Forum | Mon Sep 23 12:59:12 EDT 2013 | pauldavis4
New pcba supplier sent us first article pcbas (SMT, Wave & hand solder operations) that failed our testing due to no-clean flux residues found under ICs and around passive capacitors. Second lot came in and had 100% pass yield, but we still see a cl
Electronics Forum | Thu Oct 10 17:32:52 EDT 2013 | soscomputer
you're right for sure, but there is some brand like hakko i don't like them why ? because process and menus (controllers) doesn't really give a good result. For example fm206, hot air/desoldering/soldering station doesn't have the real tc. And a lot
Electronics Forum | Fri Jul 24 16:33:45 EDT 2015 | cnotebaert
You should be fine! best practice for a situation like this would be to run a solder sample, either flux it and run through wave, or screen print, don't place parts and run through reflow. look for proper wetting characteristics if you see de-wetting
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