Electronics Forum | Mon Sep 21 04:23:16 EDT 2009 | smtbox
R series Features FCS (Flex Calibration System) highly regarded easy maintenance just got even easier! The optional FCS calibration jig is a simple to use system to re-calibrate placement accuracy. The machine automatically picks and places jig comp
Electronics Forum | Thu Nov 12 20:37:41 EST 2009 | isd_jwendell
I used a clam-shell type for years before switching to the LPKF. The ZelPrint LT300 looks a lot like the LPKF one. I prefer the LPKF or ZelPrint style because they are capable of getting better (more accurate and more consistent) prints when compared
Electronics Forum | Mon Jan 18 10:49:22 EST 2010 | pcbrookie
Hello all, One of our resistor arrays is becoming detached from its balls after reflow. This is the second instance of this happening. The balls are clearly soldered to the board, but the actual package is coming off (package pads are quite bare).
Electronics Forum | Mon Mar 29 12:10:14 EDT 2010 | rway
Test Jet will work for catching lifted leads, certainly. X-ray is the only thing for testing for internal solder defects such as voids and cracks. I personally do not have any experience using X-ray, so I cannot advise on its reliability. Perhaps
Electronics Forum | Mon Apr 05 16:12:16 EDT 2010 | dyoungquist
We are installing via reflow soldering a crystal that has 2 pads, 1 each end. They are flat pads on the bottom of the part with a small area of the pad looping around and up the side of the crystal on the end. Inspection of the cyrstal under a 40X
Electronics Forum | Fri Jul 09 19:09:52 EDT 2010 | rway
A couple of things: Does the cap break if you try to remove it with hot air? If not, than you are breaking the caps do to mechanical stress. We have had similar issues. I don't think your board is suffering from mechanical stress from depaneling o
Electronics Forum | Tue Jun 29 14:55:22 EDT 2010 | rgduval
For the capacitors that Yageo analyzed... Were they taken out at representative points in the process?? ie. were samples taken from pre-assembly, pre-ICT, post-conformal coat, post-final test? You note that the parts 'seem' to be ok up to ICT. And
Electronics Forum | Mon Jul 26 11:36:26 EDT 2010 | rgduval
Dean, My first thought relates to your statement: "I was under the impression that manufacturing engineering was responsible..." We find any statement that begins similar to this to be indicative of other issues within an organization. Unless it'
Electronics Forum | Wed Aug 04 08:40:37 EDT 2010 | keiths487
I used to wrench on those all the time! I really > should be more help to you but it was a few years > ago... A few more things to check - clean the > line sensors on the back of the machine. Check > to make sure you don't have a feeder that i
Electronics Forum | Thu Aug 19 11:58:12 EDT 2010 | davef
From "Universal Instruments Packaging Specification" ... [snip] Packing Of Populated Boards · These parts require individual separation and protection to prevent electro static discharge and structural damage. They shall be packed in sealed, anti-st
