Electronics Forum | Tue Jun 01 07:18:15 EDT 2004 | johnwnz
Abraham, it kinda depends on your BGA ball size, device height. The probem is that very few machines will manage to get cleanign fluid under a BGA and you certainly will struggle to get it dry. You would need to look at various supponofiers as well.
Electronics Forum | Sat Jun 05 08:45:30 EDT 2004 | vinitverma
Hi Adrian, You need the UFOS program. If you send me the cad data, and the BOM, and the board layout, I can make a sample program for you to check. However the program shall not be optimized and the head nos., feeder nos., and the vision files will
Electronics Forum | Fri Jun 25 11:29:43 EDT 2004 | tcp
We have had some field returns of a double sided SMT board manufactured in the February timeframe. The boards are encapsulated in an epoxy potting. When removing the potting some SSOP devices came off in the potting. The leads had pulled out of th
Electronics Forum | Tue Jul 06 07:49:08 EDT 2004 | davef
Q1)What is the MSD level for PCB? A1) There is none Q2)I have some PCB's with HIC (humidity indicator card ) has turn to pink at 50%. Should I bake the PCB prior to assembly process.This fab is a complex board with various kind advance package assem
Electronics Forum | Thu Jul 15 12:02:38 EDT 2004 | Yngwie
We have massive void problems on one of the BGA populated on the bottom side of the board. The board have 6 BGAs on the top and 1 on the bottom. No voids were observed during the first reflow (we reflowed bottom side first), but after the second refl
Electronics Forum | Fri Jul 16 03:35:34 EDT 2004 | Yngwie
We have massive void problems on one of the BGA populated on the bottom side of the board. The board have 6 BGAs on the top and 1 on the bottom. No voids were observed during the first reflow (we reflowed bottom side first), but after the second refl
Electronics Forum | Mon Jul 26 09:19:57 EDT 2004 | davef
Both imm silver and ENIG provide flat surfaces that are better for fine pitch placement and reflow than HASL. We know of nothing that makes BGA locations different than other locations when using ENIG solderability protection. More broadly, the pri
Electronics Forum | Thu Aug 05 20:11:31 EDT 2004 | Darren
Dhanish, There are a number of things to know before we can answer a large question such as yours. 1) what machine is being used. 2) how does the machine account for height at placement. 3) is the part rotated a large amount after placement. 4) is th
Electronics Forum | Fri Aug 06 11:07:49 EDT 2004 | JB
"I thought it was purely a mechanical up-down movement with the cam and hence the thickness hardly has any effect!" It is purely mechanical.On our high speed turret the machine knows the distance between the tip of the nozzle and the top surface of
Electronics Forum | Mon Aug 02 16:54:07 EDT 2004 | davef
If you eliminate this test, how would you monitor the cleanliness of your: * Bare boards * Components * Processes You probably could get a c of c from your board fab, but a c of c from the component suppliers would be burdonsome [and agruably useles
