Electronics Forum | Tue Nov 11 12:03:39 EST 2014 | rgduval
Is anyone paying for/using Component Health Watch by IHS Technology? We're taking a look at it, but I was wondering if anyone out there had opinions. I can't tell from their website if it tracks only commodity classes, or if it tracks individual p/
Electronics Forum | Thu Nov 20 20:47:58 EST 2014 | slouis2014
Well the stencil in question have shield components. And this stencil sometimes doesn't even reach 10,000 strokes.As compared with stencil that does not have shield components, the life span seems to be lesser considering that same squeegee, print pr
Electronics Forum | Fri Dec 19 12:43:01 EST 2014 | emeto
I had some of these before and they do a decent job. Laser alignment is ok for passive components. Compared to vision systems it has mainly disadvantages. If you have bended lead on IC for example, it wouldn;t catch it and it will place the part. I w
Electronics Forum | Fri Jan 16 03:58:27 EST 2015 | skoubri
Hi i am looking for IC60 as shown. It's top mark is 4L1 L74 (two lines). 8 pin package.I suspect its somekind of comparator/amp http://s18.postimg.org/iw5ucp4qx/photo.jpg Many thanks in advance
Electronics Forum | Thu May 14 08:17:00 EDT 2015 | emeto
I am pretty sure that will vary on the paste manufacturer. Using different amount and composition of flux will give you some different viscosity. I evaluated different solder paste brands before and I can tell you that some of them are very runny com
Electronics Forum | Tue Dec 15 02:00:32 EST 2015 | padawanlinuxero
We do what here is call a master, this board has a bunch of misalign components, missing components, bad solder joints, crack components, and other defects that we want the AOI to look for, now we compare what the AOI finds with a list of the defects
Electronics Forum | Mon Sep 19 21:35:54 EDT 2016 | shriram
Appreciate your suggestion. NSMD pads are used for this design, the anomalies we found are 1. the trace running between pads has a lesser solder mask height compared the other area of the pads. 2. the NSMD pads doesnot have a trench close to pad e
Electronics Forum | Thu Sep 22 13:22:59 EDT 2016 | bobpan
Hello, The machine measures the part using the laser on the head after picking it up. It then passes or fails it by comparing it to the part size and tolerance for the pickup in the laser extents. You can see this in central controller under laser ex
Electronics Forum | Thu Oct 13 03:02:01 EDT 2016 | souldierann
I hope you could able to help me how come the fuse blown out when we powered up the board containing relays. The relays rated current is 80milliAmps only compared to the 2A fuse.The relay contact form is SPDT.
Electronics Forum | Thu Oct 20 09:58:54 EDT 2016 | davef
You say, "... re-flow profile temperature, the peak temperature of a component was on 253*C." Questions are: * I assume that was the temperature of the component body. What was the temperature of the solder ball? * How does the temperature on the pr
