Electronics Forum | Mon Jun 18 17:11:41 EDT 2007 | bigdaddysoy9
Sami, Have you tried anything to reduce your print time. For example, use the fewest fiducials possible (2 in most cases) for alignment. Get rid of unnecessary inspection sites. Adjust the start/stop of your stroke to reduce wasted movement of th
Electronics Forum | Thu Mar 27 16:40:45 EDT 2008 | slthomas
(or just some static-safe foam tape) I need to seal a wire terminal block to a board for conformal coating purposes. Currently we glue it to a shim and glue the shim to the board (yuck), but I want to use die cut gaskets if I can make it cost effec
Electronics Forum | Thu Nov 05 03:40:34 EST 2009 | valeo
Hi Rajeshmara, Mail sent with the datasheet of the glue we use in production. Thanks for first information you provide me for the shear specifications on 1206. But can you be more precise on this point ? How did you define it ? Is anyone have more
Electronics Forum | Wed Nov 25 01:00:54 EST 2009 | henry_usa_stencils
The design of the opening apertures for the glue stencil and the metal thickness.Its is very important. The Engineer of the stencils supplier have to look into the height of the components and the gap of the 2 leg(pads)and give the assemly house an s
Electronics Forum | Tue Nov 24 10:03:45 EST 2009 | andrzej
Actully none couse we glue them. Please see attached file - there are red dots marking glue placment. I understand you want to check if there is any sense in gluing components. I`ll ask one more time - Is anoyne who reworked SMDs with SAC305 where
Electronics Forum | Thu Aug 24 23:20:22 EDT 2017 | micropak
We often do double sided SMT assembly, never had issues with smaller components. However, we apply glue to heavier components like inductors, SD card sockets etc. For this purpose, we have a glue dispensing machine inline after the solder paste prin
Electronics Forum | Tue Dec 04 02:32:38 EST 2018 | ameenullakhan
Hi, Thanks for the valuable feedback. Agree with you. 1. We have similar component on both the side of the board. 2. The component fall was random like 4 out of 100 components.But last build it has increased. 3. Applying glue dot is option , bu
Electronics Forum | Sun Jun 23 02:16:47 EDT 2019 | emanuel
Some manufacturers put very strong glue, the wider the part is so increases the glue strength. May sound funny but the only thing that worked was attaching a fishing weight to the tape, need to play a little until you find the correct size. The only
Electronics Forum | Tue Jul 13 16:29:25 EDT 2021 | stephendo
I didn't see that but I was thinking he could sprinkle it with holy water and repeat in a loud firm voice, "the power of Christ compels you". Or he could find an IT forum instead of a manufacturing one where our printers use a stencil and print bric
Electronics Forum | Wed Feb 23 16:25:33 EST 2000 | John
We are using a glue and wave solder process for primarily chip components. Our products do not use any fine pitch components. What would an acceptable benchmark for the placement defect rate be? 50 DPMO? 100 DPMO? 200 DPMO? Thanks in advance,
