Electronics Forum | Wed Nov 07 17:13:51 EST 2001 | fmonette
Hany, The guidelines for proper handling and storage of moisture sensitive components, like PBGAs are clearly documented in the joint IPC/JEDEC standard J-STD-033 (free download at http://www.jedec.org). In short you need to keep track of exposur
Electronics Forum | Tue Nov 13 19:52:47 EST 2001 | davef
1800??? That's not a Mictor part number. Huh? What??? Haaaa!!!! You gotta do what???? 1800 ofem??? Haaaa!!!! Sorry. It�s simple. Just ... * Cut all the SMT gull wing leads on both sides of the connector just above the solder. * Put the co
Electronics Forum | Tue Jan 29 20:14:54 EST 2002 | davef
Please help us understand your situation better by describing the following: * Component [ie, PTH/SMT, type of component, lead finish you expected/ received, etc.] * Board type [ie, type of board FR-4/CEM/ceramic, etc.] * Solderability protection on
Electronics Forum | Wed Jul 17 11:45:48 EDT 2002 | fmonette
The current IPC/JEDEC standard J-STD-033 for moisture-sensitive devices does not include a bake cycle at 90C (it includes cycles at 40C and 125C for non-assembled components in reels or trays). However, the upcoming revision, which should be release
Electronics Forum | Wed Nov 20 03:52:16 EST 2002 | iman
Hello, need help on intrusive reflow process, thanks in advance to the experts and general info sharing :) need some help to obtain answers, to following questions: 1) PCB is FR4, 1.6mm thick, 4 layers, what stencil thickness (stencil design guide
Electronics Forum | Tue Apr 01 09:03:39 EST 2003 | kmorris
Hi: I'm looking for input from anyone who has experience assembling the MLP package on PCBs. We are experiencing solder opens after assembly, and I'm curious to see how others are processing these critters. The part we are using is a Semtech SH3000
Electronics Forum | Tue Apr 13 09:46:39 EDT 2004 | davef
Now, that's different. We misunderstood the problem from your original descrtiption. We thought the voids were showing at the via in the pad. Now, we understand the voids appear to be in the solder balls. Suggestions are: * Search the SMTnet Arch
Electronics Forum | Wed Dec 22 17:03:23 EST 2004 | jamesd
Shameless? In APE's experience not so - air velocity/power is extremely important in carrying energy to the board and close loop control of that energy is crytical in maintaining a controlled environment - if a machine design requires that air is for
Electronics Forum | Wed Nov 17 15:04:27 EST 2004 | russ
SMT assembly, First, you must utilize paste otherwise the parts will not stay put. Do you have any leaded devices such as QFPs or SOICs? Dispensing paste by hand is very difficult and time consuming for these types of parts. You can either dispense
Electronics Forum | Mon Apr 25 12:19:21 EDT 2005 | siverts
Hi all, We produced a RoHS (lead-free) prototype order recently, and there was some components that we needed to replace on a couple of PCBA's. We found it very hard to do this even with the new solder iron. The components was just small RoHS SOIC's
